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advanced packaging and interconnects

DIAMOND E-Series

DIAMOND E-Series

…laser for a wide range of materials processing applications. Datasheet DIAMOND E-1000 Applications Application Process Material Advanced Packaging and Interconnects Materials Processing Graphic Arts Cutting Drilling Printing Scribing Flex Circuit Die Board Metal Plastic Flat Panel Display Paper…

DIAMOND J-Series Lasers

DIAMOND J-Series Lasers

…wavelength, feature a common mechanical, electrical, optical, software and control interface with the only difference between models being overall package length. This consistency enables system integrators to focus more on process development, rather than laser integration and tool re-engineering,…

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