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deep uv

Paladin CompactAir DSrevA.qxd

Paladin CompactAir DSrevA.qxd

…"Warranty Void" M8-18 deep for fixing while shipping (both sides) Air intake (both sides) 7.26 mm (0.29 in.) 7.26 mm (0.29 in.) 38.1 mm (1.5 in.) 25 mm (1.0 in.) "Foot" "Foot" 80 mm (3.25 in.) Center of Gravity Center of Gravity M8 -18 mm deep 3/8"-16 -18 mm deep 3/8"-16 -18 mm deep Leave min. 80 mm…

Lasers | Photonics Handbook®

Lasers | Photonics Handbook®

…high throughput processes. They are available with powers up to tens of
watts with a choice of near-IR (1064 nm), green (532 nm) or UV (355 nm) output. The UV is popular for producing small features in "delicate" materials
because it can be focused to a small spot and minimizes peripheral…

Laser Focus World - May 2015

Laser Focus World - May 2015

…W of average output
power provides a low-cost version with
full spectral content from 400 to 2400
nm, he adds. Fianium also provides UV
or IR optimized spectral content options,
as well as an array of tunable filters that
are used to turn the broadband lasers into

Industrial Photonics - January 2014

Industrial Photonics - January 2014

…surface preparation
applications. Finally, excimer lasers offer a unique combination of high per-pulse energy and repetition rate in
the UV, thus supporting rapid material removal and high
throughput even with larger CFRP parts.
Meet the author
Frank Gäbler is director of…

SST 2017-09 Laser Marking.pdf

SST 2017-09 Laser Marking.pdf

…STATE TECHNOLOGY AUGUST/SEPTEMBER 2017 17
LASER MARKING
parent in the near IR, and lasers at this wavelength
are used whenever deep marks into silicon are required,
such as placing wafer IDs near the wafer edge. Near
IR laser markers are also selected for marking molded…

ExcimerCFRPCleaning.pdf

ExcimerCFRPCleaning.pdf

…accumulate significant amounts of heat relatively deep into the composite material. As a consequence, thermally induced stress usually reveals itself in the form of cohesive material failure. Excimer lasers, on the other hand, emit at short UV wavelengths and ablate the release agent while remaining…

Photonik Feb2014.pdf

Photonik Feb2014.pdf


using a line field (A) and a square field (B).
The grooves in the overlap area are welldiscernible and are approximately 100nm
deep [4]. As the delamination is achieved
within a single laser pulse per area, processing a 6inch sapphire wafer requires only a
few thousand…

COHERENT LMC 2016-2017 Catalog .pdf

COHERENT LMC 2016-2017 Catalog .pdf

…includes
the LaserCam-HR II CCD cameras, the LaserCam-HR-UV and
the LaserCam-HR-InGaAs models, covering the measurement spectrum from the deep ultraviolet to the near-infrared
wavelengths.
With a broad spectral range covering 190 nm to 1700 nm,
there is a LaserCam-HR camera…

Lasers-for-Life-Sciences-Product-Guide FORMFIRST.pdf

Lasers-for-Life-Sciences-Product-Guide FORMFIRST.pdf


M14 x 0.5 THREAD
X 0.375 [9.50] DEEP.
in [mm]
Ø
Ø
Structured Light Flat Top Projector
Gaussian to Flat-Top Using Refractive Beam Shaping Optics
Features
· Very efficient all glass optics
· Achromatic (from UV to near IR)
· Very smooth low ripple…

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