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excimer laser pulse shape

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…substrate under the pulsing excimer laser line beam field in one or two scans, it is possible to cover an entire Gen 4.5 substrate panel Figure 5. Sketch of the optical line beam delivery system. Table 2. Processing metrics for the Gen 4.5 substrate LLO in one scan and two scans. Laser parameters…

Laser Focus World - August 2016

Laser Focus World - August 2016

…that could deliver these kinds of benefits. The ideal laser for LTPS annealing produces high energy and UV pulses, and has an output beam conducive for shaping into a long, thin line. But this technology congruence for our particular excimer lasers was just the starting point. In fact, it took over…

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…substrate under the pulsing excimer laser line beam field in one or two scans, it is possible to cover an entire Gen 4.5 substrate panel Figure 5. Sketch of the optical line beam delivery system. Table 2. Processing metrics for the Gen 4.5 substrate LLO in one scan and two scans. Laser parameters…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…using a high power excimer laser (e.g. 300W), the beam can be shaped to cover about 1-2cm2 . The previously described SÜSS MicroTec ELP300 with integrated high power excimer laser is capable of seed layer removal throughputs of 60 to 100 wafers per hour. Conclusion Excimer lasers have been a key…

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…substrate under the pulsing excimer laser line beam field in one or two scans, it is possible to cover an entire Gen 4.5 substrate panel Figure 5. Sketch of the optical line beam delivery system. Table 2. Processing metrics for the Gen 4.5 substrate LLO in one scan and two scans. Laser parameters…

Refractive Surgery with Excimers EU OuP.pdf

Refractive Surgery with Excimers EU OuP.pdf

…enabled extremely high laser reliability levels, gas lifetimes, and laser tube lifetimes across the entire excimer product line. The ExciStar family of excimer lasers from Coherent continues to be the dominant choice of refractive surgery builders systems. These lasers made their name with a…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

pulses 900 pulses Pulse Rate 10Hz 20Hz Throughput >60 wafers/hr >60 wafers/hr Table 1: Excimer laser parameters and throughput Such requirements can be fulfilled with compact and affordable low power excimer lasers. The Coherent COMPexPro excimer laser family is an ideal source for thin wafer laser

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

pulses 900 pulses Pulse Rate 10Hz 20Hz Throughput >60 wafers/hr >60 wafers/hr Table 1: Excimer laser parameters and throughput Such requirements can be fulfilled with compact and affordable low power excimer lasers. The Coherent COMPexPro excimer laser family is an ideal source for thin wafer laser

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…using a high power excimer laser (e.g. 300W), the beam can be shaped to cover about 1-2cm2 . The previously described SÜSS MicroTec ELP300 with integrated high power excimer laser is capable of seed layer removal throughputs of 60 to 100 wafers per hour. Conclusion Excimer lasers have been a key…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…using a high power excimer laser (e.g. 300W), the beam can be shaped to cover about 1-2cm2 . The previously described SÜSS MicroTec ELP300 with integrated high power excimer laser is capable of seed layer removal throughputs of 60 to 100 wafers per hour. Conclusion Excimer lasers have been a key…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…using a high power excimer laser (e.g. 300W), the beam can be shaped to cover about 1-2cm2 . The previously described SÜSS MicroTec ELP300 with integrated high power excimer laser is capable of seed layer removal throughputs of 60 to 100 wafers per hour. Conclusion Excimer lasers have been a key…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…using a high power excimer laser (e.g. 300W), the beam can be shaped to cover about 1-2cm2 . The previously described SÜSS MicroTec ELP300 with integrated high power excimer laser is capable of seed layer removal throughputs of 60 to 100 wafers per hour. Conclusion Excimer lasers have been a key…

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