1 - 10 of 26 Search Results for fr4
|
|
|
1.
FR4 Cutting with the K2K CO 2 Laser
|
|
FR4 Cutting with the K2K CO 2 Laser To make it easy for you to access a wide range of commercial applications using lasers, we have developed an Industrial Applications finder’s tool. Coherent lasers & industrial laser applications Composite Cutting and Scribing Ablation-Material Removal NEW ...
Related Searches: acousto-optic modulator | k2k | k-2k
|
|
|
|
|
2.
Microvia Drilling of Printed Circuit Boards with UV-DPSS Lasers
|
|
... production of small microvias (less than 50 µm diameter) in chip substrates and flex packages. Laser Used: AVIA™ Family of DPSS Lasers Process: FR4 The majority of UV DPSS lasers operate at the frequency-tripled wavelength of 355 nm for microvia formation. Average output power at this UV wavelength ...
Related Searches: microvia | uv | mirror
|
|
|
|
|
5.
FR4 Circuit Board Marking with CO 2 Lasers
|
|
FR4 Circuit Board Marking with CO 2 Lasers To make it easy for you to access a wide range of commercial applications using lasers, we have developed an Industrial Applications finder’s tool. Coherent lasers & industrial laser applications Composite Marking and Engraving Ablation-Material Removal ...
Related Searches: pcb
|
|
|
|
|
6.
AVIAâ„¢ Applications
|
|
... . Application Materials Laser Model DRILLING Flex Circuit Via Holes Polymide and Copper AVIA 355-14 AVIA 355-23 Printed Circuit Board Via Holes FR4, Glass Reinforced Nylon AVIA 266-3 Copper AVIA 355-14 AVIA 355-23 Silicon Wafer and Device Via Holes Silicon AVIA 266-3 AVIA 355-23 Flat Panel Display and ...
Related Searches: avia | avia 355-23-250 | 355 nm | laser scribing
|
|
|
|
|
8.
Microvia Drilling in PCBs
|
|
... microvias. Coherent's DIAMOND sealed pulsed and Q-switched CO 2 lasers are used to drill >70 µm diameter vias in RCC (resin-coated copper), Fr4 and aramid-based dielectrics. In addition, they can be used for the Cu-direct drilling process used by leading-edge PCB manufacturers. The AVIA series ...
Related Searches: avia | laser scribing | microvia | drilling
|
|
|
|
|
9.
[index.cfm?fuseaction=Forms.ShowApp1List.cfm&startrow=16]
|
|
... Scribing Drilling Heat Treating Marking and Engraving Sub-Surface Modification Surface Modification Welding and Soldering View All Application Notes FR4 Circuit Board Marking with CO 2 Lasers It is useful to produce marks or codes on printed circuit boards during manufacture to aid in inventory control ...
Related Searches: k2k
|
|