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1 - 10 of 26 Search Results for fr4
Search Suggestions: acousto-optic modulator | microvia | k2k | k-2k | k225i | uv | laser cutting | mirror | acousto optic | cutting

1FR4 Cutting with the K2K CO 2 Laser
FR4 Cutting with the K2K CO 2 Laser To make it easy for you to access a wide range of commercial applications using lasers, we have developed an Industrial Applications finder’s tool. Coherent lasers & industrial laser applications Composite Cutting and Scribing Ablation-Material Removal NEW ...
Related Searches: acousto-optic modulator | k2k | k-2k

2Microvia Drilling of Printed Circuit Boards with UV-DPSS Lasers
... production of small microvias (less than 50 µm diameter) in chip substrates and flex packages. Laser Used: AVIA™ Family of DPSS Lasers Process: FR4 The majority of UV DPSS lasers operate at the frequency-tripled wavelength of 355 nm for microvia formation. Average output power at this UV wavelength ...
Related Searches: microvia | uv | mirror

3Microvia Drilling of Printed Circuit Board with CO 2 Lasers
... Process: A DIAMOND K-225i CO 2 laser with output at 9.4 µm was set up on an optical table. This laser was chosen because many plastics, such as FR4, demonstrate higher absorption at 9.4 µm than at 10.6 µm. The output beam from the laser was directed into a 0.6X telescope to reduce its diameter from ...
Related Searches: k225i | microvia | acousto-optic modulator

4pdf document  CircuiTreeRev2 Best match in this PDF  |  All matches in this PDF
... changes in either the phototool or the panel. These dimensional changes happen because the materials used for the mask and panel (such as FR4 and Teflon) vary in size as a function of temperature and humidity (which are controlled in the typical fab environment to ±2°C and ±5%RH, respectively). Furthermore ...
Related Searches: laser direct imaging | pcb laser direct image | beam shaper | paladin

5FR4 Circuit Board Marking with CO 2 Lasers
FR4 Circuit Board Marking with CO 2 Lasers To make it easy for you to access a wide range of commercial applications using lasers, we have developed an Industrial Applications finder’s tool. Coherent lasers & industrial laser applications Composite Marking and Engraving Ablation-Material Removal ...
Related Searches: pcb

6AVIAâ„¢ Applications
... . Application Materials Laser Model DRILLING Flex Circuit Via Holes Polymide and Copper AVIA 355-14 AVIA 355-23 Printed Circuit Board Via Holes FR4, Glass Reinforced Nylon AVIA 266-3 Copper AVIA 355-14 AVIA 355-23 Silicon Wafer and Device Via Holes Silicon AVIA 266-3 AVIA 355-23 Flat Panel Display and ...
Related Searches: avia | avia 355-23-250 | 355 nm | laser scribing

7pdf document  EOfeb06Semi Best match in this PDF  |  All matches in this PDF
... chips. Problems such as registration errors between the PCB layers may occur because the materials used for the mask and panel (such as FR4 and Teflon) expand and contract as ambient temperature and humidity changes. Photo-tools can also be damaged or contaminated easily, leading to errors in the final ...
Related Searches: interferometry | paladin | soft wafer mark | ldi

8Microvia Drilling in PCBs
... microvias. Coherent's DIAMOND sealed pulsed and Q-switched CO 2 lasers are used to drill >70 Âµm diameter vias in RCC (resin-coated copper), Fr4 and aramid-based dielectrics. In addition, they can be used for the Cu-direct drilling process used by leading-edge PCB manufacturers. The AVIA series ...
Related Searches: avia | laser scribing | microvia | drilling

9[index.cfm?fuseaction=Forms.ShowApp1List.cfm&startrow=16]
... Scribing Drilling Heat Treating Marking and Engraving Sub-Surface Modification Surface Modification Welding and Soldering View All Application Notes FR4 Circuit Board Marking with CO 2 Lasers It is useful to produce marks or codes on printed circuit boards during manufacture to aid in inventory control ...
Related Searches: k2k

10pdf document  LaserProc_futureHDIrev2 Best match in this PDF  |  All matches in this PDF
... materials used for manufacturing HDIS include copper and organic dielectrics such as un-reinforced epoxyresin (RCF) or polyimide (Kapton) and glass (Fr4), PTFE (Teflon) or aramid (Thermount) reinforced dielectrics. Ceramic substrates commonly used in thick and thin film applications include aluminum ...
Related Searches: beam finder co2 | picosecond laser | highlights | uv lasers


Search Suggestions: acousto-optic modulator | microvia | k2k | k-2k | k225i | uv | laser cutting | mirror | acousto optic | cutting
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