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1.    MicromachiningWithTalisker Best match in this PDF  |  All matches in this PDF …nm pulses. Figure 2. Trepanned hole in silicon using 355 nm pulses. Figure 3. 1064 nm scribing of 20 nm aluminum on glass Galvo speed 4m/s Galvo speed 3m/s Galvo speed 3m/s Galvo speed 4m/s Related Searches: silicon drilling | glass drilling | 1064 nm picosecond laser | high-aspect-ratio laser micro-machining

2.  Laser Based Electronics Manufacturing  (PAGE 7 OF 10) …shorter than 1064 nm due to the higher absorption of silicon at 355 and 532 nm. Figure 6. 1064 nm scribing of 20 nm aluminum on glass Galvo speed 4m/s Galvo speed 3m/s

3.    HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2 Best match in this PDF  |  All matches in this PDF …scanner guides the beam accurately and at high speed over the target to create complex features. The laser beam was switched with a fast Lambda Physik galvo shutter, with an open / close response time of < 1 msec. A beam expansion telescope was used to increase the diameter of the beam, which was then guided… Related Searches: 355 nm diode | trepanning head | 355 nm laser | silicon drilling

4.  Coherent Inc. Questions often asked when considering a laser cutter. …of a bridge-like frame designed to move along a set of tracks over an XY table. Galvo-based Laser System. Galvo systems direct a laser beam by a fast moving mirror (similar to a signal mirror reflecting sunlight). Galvo laser systems are generally suited to cutting thin materials in a relatively small… Related Searches: fiber laser | laser glass cutting | laserlink | cnc

5.  MicromachiningWithTalisker.pdf  (PAGE 1 OF 1) …Trepanned hole in silicon using 355 nm pulses. Figure 3. 1064 nm scribing of 20 nm aluminum on glass Galvo speed 4m/s Galvo speed 3m/s Galvo speed 3m/s Galvo speed 4m/s Related Searches: high-aspect-ratio laser micro-machining | silicon drilling

6.    PrecisionMaterialsProcessingwithTaliskerLasers1 Best match in this PDF  |  All matches in this PDF …wavelengths shorter than 1064 nm due to the higher absorption of silicon at 355 and 532 nm. Figure 6. 1064 nm scribing of 20 nm aluminum on glass Galvo speed 4m/s Galvo speed 3m/s Page 8 Thin Film Removal The general trend of increased miniaturization in electronics is also manifesting in the use of ever thinner… Related Searches: high-aspect-ratio laser micro-machining | pulse fiber laser | glass micromachining | nanosecond

7.  HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2.pdf  (PAGE 2 OF 9) …guides the beam accurately and at high speed over the target to create complex features. The laser beam was switched with a fast Lambda Physik galvo shutter, with an open / close response time of < 1 msec. A beam expansion telescope was used to increase the diameter of the beam, which was… Related Searches: trepanning head

8.  Laser Based Electronics Manufacturing  (PAGE 7 OF 10) …shorter than 1064 nm due to the higher absorption of silicon at 355 and 532 nm. Figure 6. 1064 nm scribing of 20 nm aluminum on glass Galvo speed 4m/s Galvo speed 3m/s

9.  Laser Based Electronics Manufacturing  (PAGE 7 OF 10) …shorter than 1064 nm due to the higher absorption of silicon at 355 and 532 nm. Figure 6. 1064 nm scribing of 20 nm aluminum on glass Galvo speed 4m/s Galvo speed 3m/s

10.    60410-346e-ILS Best match in this PDF  |  All matches in this PDF …patterns over an extended area (see Figure 1). Conversely, the beam producedbymanysolid-statelasersisusuallyfocusedtoasmall spot and scanned with galvo mirrors. This is called direct writing (see Figure 2), and the pin-point nature of direct writing has its own specific range of applications, such as… Related Searches: beam shaping optics | matrix

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Search Suggestions: silicon drilling | glass drilling | 1064 nm picosecond laser | 355 nm diode | trepanning head | 355 nm laser | high-aspect-ratio laser micro-machining | sapphire | beam shutter | 532nm pulsed laser

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