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1 - 10 of 260 Search Results for glass drilling

1DrillingOfGlass.PDF  (PAGE 2 OF 7)
drilled through the
fluorescence area becomes clearly defined and the observed fluorescence became more intensive allowing us to
determine exactly the drilling time. This behaviour indicates that some laser light must be shining through
microcracks in the glass already after half the drilling

2pdf document  PrecisionMaterialsProcessingwithTaliskerLasers1 Best match in this PDF  |  All matches in this PDF
…throughput is significantly lower than in the case of percussion drilling. Deeper vias can be drilled with wavelengths shorter than 1064 nm due to the higher absorption of silicon at 355 and 532 nm. Figure 6. 1064 nm scribing of 20 nm aluminum on glass Galvo speed 4m/s Galvo speed 3m/s Page 8 Thin Film Removal…
Related Searches: trepanning | high-aspect-ratio laser micro-machining | pulse fiber laser | glass micromachining

3pdf document  DrillingOfGlass 2 Best match in this PDF  |  All matches in this PDF
…some material. As a solution the drilling of the wafer from both sides of the wafer allows us to produce crack free holes. Introduction In the literature we can observe growing efforts to process various technical glasses (quartz glass, BK7, BGG31 and other glasses) using excimer laser wavelengths…
Related Searches: ultrasonic | laser induced fluorescence | laser glasses

4Coherent Inc. Lasers enable Microelectronics Applications
…process. -- SELECT MATERIAL -- Ceramic Composite Diamond Fabric and Leather Glass Metal Paper Plastic Semiconductor Wood and Derivatives -- SELECT PROCESS -- Ablation-Material Removal Cladding Cutting and Scribing Drilling Heat Treating Marking and Engraving Sub-Surface Modification Surface Modification…
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5pdf document  MicromachiningWithTalisker Best match in this PDF  |  All matches in this PDF
…using small spot sizes of ~10 m. At this spot size, vias as deep as 200 m and 5 to 15 m wide can be drilled with a low number of pulses (around 10) and a pulse energy requirement is <25 J. The drilling rate can be of the order of 1500 to 1800 vias/s, or more by parallel processing by splitting the 100…
Related Searches: trepanning | silicon drilling | 1064 nm picosecond laser

6Highlights No. 57 zur PDF.QXP  (PAGE 8 OF 8)
…,
ceramic, steel, glass and diamond, at various
wavelengths from the first to the third
harmonic (1064nm, 532nm and 355nm)
were performed using the StarLine at the
Institute for Laser Technology (ILT).
High aspect ratios were reached in drilling
of small holes with…

7pdf document  MicroLas brochure Best match in this PDF  |  All matches in this PDF
…applications such as micro-hole drilling. We understand how to produce the necessary mechanical stability and precision, while delivering the required energy uniformity and stability. Applications support. With extensive experience in a broad range of applications, from hole drilling to spectroscopy and silicon…
Related Searches: beam homogenizer | microlas | beam delivery system

8pdf document  Talisker Glass Micromachining Best match in this PDF  |  All matches in this PDF
…laser to machine high quality features in glass. Cracking and chipping are major issues when cutting glass by mechanical means or with a laser. 1.1 Optical properties of glass As mentioned previously the biggest obstacle to overcome when laser drilling glass is its high transparency to commonly used…
Related Searches: glasses | glass micromachining | 1064 nm picosecond laser

9DrillingOfGlass.PDF  (PAGE 3 OF 7)
…SiO2-film in order to
reduce the force on the wafer during drilling through. However, those films did not distinctly improve the
quality of the holes.
In another experiment we put a second Pyrex glass wafer beneath the drilled wafer, but also without any positive
result. Only after putting…

10pdf document  Solar Cell Scribing AILU 1207 Best match in this PDF  |  All matches in this PDF
…through (EWT) devices, power-conveying busbars are moved to the rear surface as well, leaving the front free of metal. This is made possible by drilling tiny vias to connect the front surface with rear-surface contacts. With MWT, this requires about 200 holes/wafer. With EWT, up to 20,000 of these…
Related Searches: solar cell scribing | laser scribing | edge isolation


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