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glass ablation

Microelectronics

Microelectronics

…evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser, but it is possible to ablate material with a continuous wave (CW) laser if the laser intensity is high enough. The depth over which…

Materials Processing & Industrial Applications

Materials Processing & Industrial Applications

…thinner glass and advanced material mixes. Related Products DIAMOND E-Series Monaco MATRIX QS DPSS Lasers HYPER RAPID Related Product Families Laser Tools and Systems Laser Glass Engraving Coherent lasers are the ideal source for microstructuring inside glass. When marking and engraving glass, a…

Life Sciences and Medical Applications

Life Sciences and Medical Applications

…precisely controllable ArF excimer laser beam. This technique has already helped millions of people since the early 1990s to enjoy life without glasses or contact lenses. Coherent is the leading supplier of light sources for this rapidly-expanding industry. By being the first to engineer extremely…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…cut (6 mm radius circle) in thin glass (50 µm thick) at a feed rate of 140 mm /sec. Laser Ablation Laser ablation relies on a completely different mechanism to process glass than CO2 and CO lasers, which utilize thermal shock to create a crack. Rather, ablation is the actual removal of material,…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…cut (6 mm radius circle) in thin glass (50 µm thick) at a feed rate of 140 mm /sec. Laser Ablation Laser ablation relies on a completely different mechanism to process glass than CO2 and CO lasers, which utilize thermal shock to create a crack. Rather, ablation is the actual removal of material,…

OLED Flexible Displays OPE2017 .pdf

OLED Flexible Displays OPE2017 .pdf

…and for laser lift-off to separate flexible display films from glass substrates. Other important applications are the use of ultra-short pulse (USP) lasers for circuit repair, both CO2 and USP lasers for film and foil ablation and glass cutting, and a variety of marking applications employing both…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

glass and two different types of alkali-free glass samples. These typical data show the ablation rate decreases vary slightly as the hole gets deeper in all the samples, as is typical for laser micromachining of glass. They also clearly show that the ablation rates for borosilicate glasses are much…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

glass and two different types of alkali-free glass samples. These typical data show the ablation rate decreases vary slightly as the hole gets deeper in all the samples, as is typical for laser micromachining of glass. They also clearly show that the ablation rates for borosilicate glasses are much…

Talisker-1000-Series-Data-Sheet-August-2014.pdf

Talisker-1000-Series-Data-Sheet-August-2014.pdf

…Area) laser diode material Talisker 1000 Series Applications: · 3D Microstructuring · Advanced Packaging and Interconnects · c-Si Dielectric Ablation · Ceramic Processing · Flex Circuit Machining · Glass Cutting and Scribing · Laser Ablation · Laser Direct Patterning www.Coherent.com/Talisker1000

Talisker-1000-Series-Data-Sheet-August-2014.pdf

Talisker-1000-Series-Data-Sheet-August-2014.pdf

…Area) laser diode material Talisker 1000 Series Applications: · 3D Microstructuring · Advanced Packaging and Interconnects · c-Si Dielectric Ablation · Ceramic Processing · Flex Circuit Machining · Glass Cutting and Scribing · Laser Ablation · Laser Direct Patterning www.Coherent.com/Talisker1000

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…There are five technologies that have been considered for drilling these "through glass vias" (TGVs) in interposers3, 4) : · chemical wet etching · dry etching · sand blasting · ultra sound drilling · laser ablation The laser is already a preferred mature tool for micromachining in numerous aspects…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…There are five technologies that have been considered for drilling these "through glass vias" (TGVs) in interposers3, 4) : · chemical wet etching · dry etching · sand blasting · ultra sound drilling · laser ablation The laser is already a preferred mature tool for micromachining in numerous aspects…

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