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25 - 36 of 43 Products for 'glass ablation' Page 3 of 4 |

glass ablation

COHR Monaco1035 DS 0318 5.pdf

COHR Monaco1035 DS 0318 5.pdf

…such as glass and metals, as well as complex, layered structures for the FPD and mobile markets are readily addressed with Monaco's sub-350 fs pulsewidth. Additionally, on-the-fly tuning enables variable pulsewidths to >10 ps. FEATURES & BENEFITS · 80 µJ/pulse for processing of high ablation

COHR MaterialsProcessingBrochure 0816revA 3.pdf

COHR MaterialsProcessingBrochure 0816revA 3.pdf

…cut, laser scribing, ablation and non-thermal processes
such as filamentation. CO2 lasers provide the highest speed for
straight cuts with perfect edge quality.The non-thermal processing
of picosecond lasers come to play for ultra-thin glass, strengthened
glass or sapphire with…

Industrial Photonics - October 2014

Industrial Photonics - October 2014

…this. The first relates to the fact that every material has an ablation threshold (the minimum peak intensity required to vaporize and remove material) related to pulse duration. Reducing the pulse duration generally reduces the ablation threshold. This means that the required pulse energy decreases…

Photonics Spectra - March 2018

Photonics Spectra - March 2018

…any
glass type at speeds up to 2 m/s and glass
thicknesses up to 10 mm.
However, one limitation in some applications is that these picosecond systems
are not completely material neutral. Cutting mixed layer substrates, such as polyimide on glass and metal on glass, often

The PCB Magazine, November 2015

The PCB Magazine, November 2015

glass makes it easy to register
fiducial marks on one side of the glass when it
is flipped over for drilling from the second side.
Overall, this testing showed that vias down to
5 µm diameter could be successfully produced.
In addition, mask-based excimer laser ablation

COHR MonacoSmartCleave DS 0318 4.pdf

COHR MonacoSmartCleave DS 0318 4.pdf

…the options for glass and film cutting to enable next generation display production. FEATURES & BENEFITS · >320 µJ/pulse for cutting 0.1 mm to >2 mm thick materials · >150 kHz seeder burst mode to enable >1 m/s cutting speeds · Femtosecond performance for filament and ablative cutting in a…

COHR HyperRapid50 DS 0716 4.pdf

COHR HyperRapid50 DS 0716 4.pdf

…on demand trigger with <20 ns jitter · 20 ns-burst mode capability for increased ablation rate · Efficient micromachining in multiple beam work stations HyperRapid 50 Applications: · Cutting and drilling of glass, sapphire, ceramics and other tough materials, also composites · Micromachining and…

Industrial Laser Solutions - January / February 2014

Industrial Laser Solutions - January / February 2014

…these methods has limitations in terms of either speed, complexity, or the need for subsequent cleaning. Excimer laserbased surface cleaning and ablation now offers a practical alternative that yields a pristine surface with the requisite characteristics for adhesive bonding. This article reviews…

Europhotonics - Spring 2016

Europhotonics - Spring 2016

…such as catheters and infusion/fluid delivery devices; and creating permanent counterfeit-proof marks without surface damage in plastic products, glass syringes and vials. "Laser micromachining offers the potential for removal or transformation of material with incredible spatial selectivity and…

HYPERRAPID100 DS 0414 5.pdf

HYPERRAPID100 DS 0414 5.pdf

…jitter · 20 ns-burst mode capability for increased ablation rate · 1064 nm or 532 nm version · AOM process shutter · Efficient micromachining in multiple beam work stations HYPER RAPID 100 Applications: · Cutting and drilling of strengthened glass, sapphire, ceramics and other tough materials, also…

COHR HyperRapid100 355-SW DS 0716 6.pdf

COHR HyperRapid100 355-SW DS 0716 6.pdf

…· Pulse to pulse energy modulation · 20 ns-burst mode capability for increased ablation rate · High throughput at significantly reduced TCO HyperRapid 100 355-SW Applications: · Cutting and drilling of strengthened glass, sapphire, ceramics and other tough materials, also composites · Micromachining…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

…significantly larger glass substrates, which are used only for digital displays, line scan techniques have become established. To this end, homogeneous lines up to 750mm in length are available and ensure a fast separation of the functional layers on up to 2500 x 2200mm2 glass substrate area.…

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