Ask a Question
Coherent
Search Results
25 - 36 of 126 Products for 'glass ablation' Page 3 of 11 |

glass ablation

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…less effective and more costly as circuit dimensions shrink, so excimer laser ablation offers an attractive alternative in many cases. This article looks at the use of excimer laser ablation for drilling glass interposers, and reviews how excimers have been successfully employed in a turnkey…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…less effective and more costly as circuit dimensions shrink, so excimer laser ablation offers an attractive alternative in many cases. This article looks at the use of excimer laser ablation for drilling glass interposers, and reviews how excimers have been successfully employed in a turnkey…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…less effective and more costly as circuit dimensions shrink, so excimer laser ablation offers an attractive alternative in many cases. This article looks at the use of excimer laser ablation for drilling glass interposers, and reviews how excimers have been successfully employed in a turnkey…

COHR Monaco DS 0117 6.pdf

COHR Monaco DS 0117 6.pdf

…Burst Mode capable · Single-box solution · HALT designed/HASS certified · Remote access via ethernet interface APPLICATIONS · Glass Cutting and Drilling · Thin Film Ablation · Wafer Scribing · Complex Layer Processing · Precise Metal Marking and Cutting · Stent Fabrication · Ophthalmic Applications…

COHR Monaco DS 0317 7.pdf

COHR Monaco DS 0317 7.pdf

…Burst Mode capable · Single-box solution · HALT designed/HASS certified · Remote access via ethernet interface APPLICATIONS · Glass Cutting and Drilling · Thin Film Ablation · Wafer Scribing · Complex Layer Processing · Precise Metal Marking and Cutting · Stent Fabrication · Ophthalmic Applications…

COHR Monaco DS 0617 13.pdf

COHR Monaco DS 0617 13.pdf

…Burst Mode capable · Single-box solution · HALT designed/HASS certified · Remote access via ethernet interface APPLICATIONS · Glass Cutting and Drilling · Thin Film Ablation · Wafer Scribing · Ceramics and Polymer Processing · Precise Metal Marking and Cutting · Stent Fabrication · OPA Pumping…

COHR Monaco DS 0617 13.pdf

COHR Monaco DS 0617 13.pdf

…Burst Mode capable · Single-box solution · HALT designed/HASS certified · Remote access via ethernet interface APPLICATIONS · Glass Cutting and Drilling · Thin Film Ablation · Wafer Scribing · Ceramics and Polymer Processing · Precise Metal Marking and Cutting · Stent Fabrication · OPA Pumping…

x lase A4 4s 02 2013 lr 1 .pdf

x lase A4 4s 02 2013 lr 1 .pdf

INDUSTRIAL PICOSECOND FIBER LASERS X-LASE SERIES LOW-K GROOVING AI ON PET ABLATION SAPPHIRE SCRIBING GLASS-GLASSWELDING GLASS-METAL-GLASSWELDING Rofin Group company

x lase A4 4s 02 2013 lr 1 .pdf

x lase A4 4s 02 2013 lr 1 .pdf

INDUSTRIAL PICOSECOND FIBER LASERS X-LASE SERIES LOW-K GROOVING AI ON PET ABLATION SAPPHIRE SCRIBING GLASS-GLASSWELDING GLASS-METAL-GLASSWELDING Rofin Group company

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the figure above. Both the…

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the figure above. Both the…

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the figure above. Both the…

Powered by Site Search powered by SLI Systems

Call 1-800-227-8840


Outside the U.S. 1-408-764-4983

Coherent has locations across the globe that are available to provide support for any product, service or inquiry.

Visit our Contact Page to connect with any of our global sites.


Corporate Headquarters
Coherent Inc.
5100 Patrick Henry Drive
Santa Clara, CA 95054 USA

email: tech.sales@coherent.com

Send Us a Message

Please Read Before Continuing

Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.


I have read the terms and conditions