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glass ablation

COHR Monaco DS 0617 13.pdf

COHR Monaco DS 0617 13.pdf

…Burst Mode capable · Single-box solution · HALT designed/HASS certified · Remote access via ethernet interface APPLICATIONS · Glass Cutting and Drilling · Thin Film Ablation · Wafer Scribing · Ceramics and Polymer Processing · Precise Metal Marking and Cutting · Stent Fabrication · OPA Pumping…

COHR Monaco DS 0617 13.pdf

COHR Monaco DS 0617 13.pdf

…Burst Mode capable · Single-box solution · HALT designed/HASS certified · Remote access via ethernet interface APPLICATIONS · Glass Cutting and Drilling · Thin Film Ablation · Wafer Scribing · Ceramics and Polymer Processing · Precise Metal Marking and Cutting · Stent Fabrication · OPA Pumping…

x lase A4 4s 02 2013 lr 1 .pdf

x lase A4 4s 02 2013 lr 1 .pdf

INDUSTRIAL PICOSECOND FIBER LASERS X-LASE SERIES LOW-K GROOVING AI ON PET ABLATION SAPPHIRE SCRIBING GLASS-GLASSWELDING GLASS-METAL-GLASSWELDING Rofin Group company

x lase A4 4s 02 2013 lr 1 .pdf

x lase A4 4s 02 2013 lr 1 .pdf

INDUSTRIAL PICOSECOND FIBER LASERS X-LASE SERIES LOW-K GROOVING AI ON PET ABLATION SAPPHIRE SCRIBING GLASS-GLASSWELDING GLASS-METAL-GLASSWELDING Rofin Group company

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the figure above. Both the…

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the figure above. Both the…

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the figure above. Both the…

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…possible. Close to this threshold value, lift-off delamination was incomplete and uncontrollable. For the proposed PI glass system, optimum lift-off conditions slightly above the ablation threshold were achieved at a fluence value of 235 mJ/cm2 . Increasing the fluence to a value beyond 250 mJ/cm2…

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…possible. Close to this threshold value, lift-off delamination was incomplete and uncontrollable. For the proposed PI glass system, optimum lift-off conditions slightly above the ablation threshold were achieved at a fluence value of 235 mJ/cm2 . Increasing the fluence to a value beyond 250 mJ/cm2…

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…sand blasting, ultrasound drilling, or laser ablation. As with cutting, hole drilling in glass interposers is extremely sensitive to the excess heat generated by the strong absorption of CO2 laser light. The lower absorption of 5 µm light in glass again provides an advantage in this application,…

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…sand blasting, ultrasound drilling, or laser ablation. As with cutting, hole drilling in glass interposers is extremely sensitive to the excess heat generated by the strong absorption of CO2 laser light. The lower absorption of 5 µm light in glass again provides an advantage in this application,…

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…sand blasting, ultrasound drilling, or laser ablation. As with cutting, hole drilling in glass interposers is extremely sensitive to the excess heat generated by the strong absorption of CO2 laser light. The lower absorption of 5 µm light in glass again provides an advantage in this application,…

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