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13 - 24 of 74 Products for 'glass cutting' Page 2 of 7 |

glass cutting

MATRIX Family of Q-Switch Lasers | Coherent

MATRIX Family of Q-Switch Lasers | Coherent

…Datasheet Matrix Accessories Applications Application Process Material Materials Processing Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard…

DIAMOND J-Series Lasers

DIAMOND J-Series Lasers

…marking, engraving, cutting, perforating and drilling. The long wave infrared output of these CO2 lasers makes them compatible with numerous organic materials, including paper, cardboard, plastic films, textiles, leather, wood, plastics, and carbon composites, as well as glass and even thin metals.

Femtosecond Lasers

Femtosecond Lasers

…lasers is ideal for ultra-fine processing of materials with little or no heat affected zone (HAZ). Target materials for these lasers include glass, OLED, IC packages/wafers, and flexible thin films. Monaco: Up to 80 µJ/pulse at 60 W in 10 W average power at 100 kHz to enable high throughput…

(No Title Available)

(No Title Available)

…offers energy and repetition rate agility required to cover a wide range of applications such mobile device manufacturing, glass cutting, OLED display processing, wafer cutting, and chip-level packaging, just to name a few. Data Sheet Monaco 1035 Opera-F and Opera-HP for Monaco Optical Parametric…

Materials Processing & Industrial Applications

Materials Processing & Industrial Applications

…Laser Cutting for Glass Reinforced Plastic & Carbon Fiber Achieve optimal cutting speed and cut quality by using lasers to cut carbon or glass reinforced plastic. Due to the fact that the melting point of fibers is much higher than the melting point of the resin, laser cutting of glass reinforced…

(No Title Available)

(No Title Available)

…offers energy and repetition rate agility required to cover a wide range of applications such mobile device manufacturing, glass cutting, OLED display processing, wafer cutting, and chip-level packaging, just to name a few. Data Sheet Monaco 1035 DIAMOND J-Series The J-Series CO 2 lasers, built on a…

(No Title Available)

(No Title Available)

…from Coherent is not only an excellent cutting laser but also the ideal tool for a wide variety of applications. The DC Series CO 2 lasers are perfectly suitable not only for the processing of metals but also of wood, plastics – also fiber-reinforced – glass, textiles or paper. Data Sheet DC Series…

Microelectronics

Microelectronics

…IndyStar ExciStar Paladin Compact 355 Sapphire LP/LPX Related Product Families Sapphire Lasers Laser Machines and Systems Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…laser cut glass can typically
withstand two to three times as much force as mechanically cut glass.
Figure 1. Comparison of mechanically cut (left) and laser cut (right) glass. The mechanically cut glass shows
significant residual stress, and substantial debris from the cutting

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…Corning's Gorilla Glass, Asahi's
Dragontrail and Schott's Xensation are
examples of this. The thickness of this
strengthened layer typically runs tens of
microns deep.
Traditional mechanical glass cutting can lead to microcracks and debris.
Laser glass cutting, based on…

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

…rounded cuts and
contours, and even cutouts.
Typically, these requirements translate into a cutting kerf width of only 25 µm, and a process
affected zone in the tens of micrometers range. This level of precision precludes virtually all
traditional mechanical cutting methods.…

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf


Cutting through transparent solder masks (because these darken when heated)
Cutting through brittle layers, such as ceramics, glass or composite (including glass fibers),
and when there is a requirement to keep any chips formed smaller than a few tens of
microns
Cutting

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