…qualify a process for cutting thin glass -- less than
1 mm -- using an ultrafast laser.
This producer had been cutting glass mechanically,
but this necessitated grinding and polishing post-cut to
deliver the desired cut edge quality. Also, mechanical
cutting didn't have the…
Cutting through transparent solder masks (because these darken when heated)
Cutting through brittle layers, such as ceramics, glass or composite (including glass fibers),
and when there is a requirement to keep any chips formed smaller than a few tens of
…devices is impacting the glass substrates used in today's mobile
devices requiring thinner glass with higher degrees of mechanical strength and scratch resistance. This
trend also includes use of sapphire instead of glass. Mechanical means of cutting these glass and
…Compact and light weight with common interfacing for all models for easy integration APPLICATIONS · Cutting and drilling of glass, sapphire, ceramics and other brittle materials and composites · Cutting, drilling, selective removal of complex composite structures from dissimilar materials, including…
process or any other laser-based process, how does that
impact reliability? Does it help you? Does it hurt you?
If so, by how much?" Boyce said.
Strengthened glass cut at 1500 mm/s using a UV hybrid fiber laser.
…engraved in an eyeglass lens
unmistakably identifies its manufacturer and
provides a guarantee of quality. An eye glass
manufacturer contemplating cutting costs
by opting for an inferior, longer wavelength
engraving laser technology overlooks that
he puts nothing less…
For cutting, scribing and hole drilling in glass and
sapphire, the Helios laser offers advantages over both
nanosecond and even shorter pulse, ultrafast lasers.
Once again, the advantage over longer pulsewidth
lasers is cut quality. Specifically, this…
· The HAZ requirement is <50
· Cutting through transparent
solder masks (because these
darken when heated)
· Cutting through brittle layers,
such as ceramics, glass or
composite (including glass
fibers), and when there is
a requirement to…
…mode capability for increased ablation rate · Efficient micromachining in multiple beam work stations HyperRapid 50 Applications: · Cutting and drilling of glass, sapphire, ceramics and other tough materials, also composites · Micromachining and structuring of large surfaces with line focusing or…
Furthermore, the cut edge must be smooth
enough to allow easy insertion and ejection of
Mechanical cutting is adequate for the straight
cuts in this application, but can't produce the
tightly radiused edges or notches. Abrasive
waterjet cutting is sometimes…
…532 nm version · AOM process shutter · Efficient micromachining in multiple beam work stations HYPER RAPID 100 Applications: · Cutting and drilling of strengthened glass, sapphire, ceramics and other tough materials, also composites · Micromachining and structuring of large surfaces with line foci…
…capability for increased ablation rate · High throughput at significantly reduced TCO HyperRapid 100 355-SW Applications: · Cutting and drilling of strengthened glass, sapphire, ceramics and other tough materials, also composites · Micromachining and structuring of large surfaces with line focusing…
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