Search Results

37 - 48 of 74 Products for 'glass cutting' Page 4 of 7 |
Related Categories: 355 Nm Laser | Tunable Cw Laser | Revolution 80 | Opo | E 250

glass cutting

Industrial Laser Solutions - May/June 2015

Industrial Laser Solutions - May/June 2015

…residual stress in the glass. The result is a better-quality cut, stronger glass, and a wider cut process window (FIGURE). Another important advantage is that the CO laser enables radial (free-form) glass cutting. In contrast, CO 2 lasers can only produce straight-line cuts because the inherently…

EU LTJ Ultrashort Pulses Improving the Process.pdf

EU LTJ Ultrashort Pulses Improving the Process.pdf

…to cut thin (<1 mm) sheet glass for use in displays. This producer had been cutting glass mechanically, but this necessitated post-processing (grinding) to deliver the desired cut edge quality. Also, mechanical cutting didn't have the capability to produce newer designs with curved cuts, or to…

Improving and Quantifying the Process Window

Improving and Quantifying the Process Window

…to cut thin (< 1 mm) sheet glass for use in displays. This producer had been cutting glass mechanically, but this necessitated post-processing (grinding) to deliver the desired cut edge quality. Also, mechanical cutting didn't have the capability to produce newer designs with curved cuts, or to…

COHR MaterialsProcessingBrochure 0816revA 3.pdf

COHR MaterialsProcessingBrochure 0816revA 3.pdf

…as filamentation. CO2 lasers provide the highest speed for
straight cuts with perfect edge quality.The non-thermal processing
of picosecond lasers come to play for ultra-thin glass, strengthened
glass or sapphire with rounded corners, inner holes and slots.
Glass Cutting

COHR DIAMOND E-1000 DS 0817 1.pdf

COHR DIAMOND E-1000 DS 0817 1.pdf

…with on-board internetaccessible diagnostics APPLICATIONS · High Speed Digital Converting · Through-cutting, Kiss-cutting, and Perforation · Engraving · Die Board Cutting · Glass Cutting and Thermal Processing · Ceramic Drilling and Scribing · Automotive · 3D Printing · Semiconductor Processing

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

…down to 25 µm · CO2 Laser-like low cost of ownership APPLICATIONS · Glass Processing · Film Cutting · Micro Via Drilling · Ceramic Processing · Metal Processing · Selective Laser Sintering · Surgical - Tissue Cutting and Cauterization · Aesthetics - Fractal Skin Resurfacing Diamond J-3-5…

Coherent

Coherent

…devices is impacting the glass substrates used in today's mobile
devices requiring thinner glass with higher degrees of mechanical strength and scratch resistance. This
trend also includes use of sapphire instead of glass. Mechanical means of cutting these glass and
sapphire pieces…

34706a cover.indd

34706a cover.indd

…devices is impacting the glass substrates used in today's mobile
devices requiring thinner glass with higher degrees of mechanical strength and scratch resistance. This
trend also includes use of sapphire instead of glass. Mechanical means of cutting these glass and
sapphire pieces…

Industrial Photonics - April 2016

Industrial Photonics - April 2016

…qualify a process for cutting thin glass -- less than
1 mm -- using an ultrafast laser.
This producer had been cutting glass mechanically,
but this necessitated grinding and polishing post-cut to
deliver the desired cut edge quality. Also, mechanical
cutting didn't have the…

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf


Cutting through transparent solder masks (because these darken when heated)
Cutting through brittle layers, such as ceramics, glass or composite (including glass fibers),
and when there is a requirement to keep any chips formed smaller than a few tens of
microns
Cutting

32311a coverSinglesRR.indd

32311a coverSinglesRR.indd

…devices is impacting the glass substrates used in today's mobile
devices requiring thinner glass with higher degrees of mechanical strength and scratch resistance. This
trend also includes use of sapphire instead of glass. Mechanical means of cutting these glass and
sapphire pieces…

COHR HyperRapidNX DS 0618 1.pdf

COHR HyperRapidNX DS 0618 1.pdf

…Compact and light weight with common interfacing for all models for easy integration APPLICATIONS · Cutting and drilling of glass, sapphire, ceramics and other brittle materials and composites · Cutting, drilling, selective removal of complex composite structures from dissimilar materials, including…

Powered by Site Search powered by SLI Systems

Please Read Before Continuing

Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.


I have read the terms and conditions