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1 - 12 of 238 Products for 'glass drilling' Page 1 of 20 |

glass drilling

DrillingOfGlass.PDF

DrillingOfGlass.PDF

…4.4 J/cm2 5.2 J/cm2 7.2 J/cm2 11.6 J/cm2 back side front side back side front side back side front side Fig.5: SEM images of 50 µm holes in 500 µm thick Pyrex glass drilled with different laser fluences and repetition rates. 50 Hz 500 Hz 200 Hz Repetition rate: 20 µm 20µm 20µm 20µm 20 µm 20 µm

Commercial Applications of High Power Picosecond Lasers

Commercial Applications of High Power Picosecond Lasers

…multiple axis workstation this can be removed. 1mm 200µm 50µm50µm Figure 6. High quality sidewall in glass drilled using 10 µJ, 355 nm pulses. Figure 5. High quality 440 µm deep holes in glass drilled using 10 µJ, 355 nm pulses. 500µm Figure 7. 2mm square micromilled area in pyrex using 355nm…

Commercial Applications of High Power Picosecond Lasers

Commercial Applications of High Power Picosecond Lasers

…multiple axis workstation this can be removed. 1mm 200µm 50µm50µm Figure 6. High quality sidewall in glass drilled using 10 µJ, 355 nm pulses. Figure 5. High quality 440 µm deep holes in glass drilled using 10 µJ, 355 nm pulses. 500µm Figure 7. 2mm square micromilled area in pyrex using 355nm…

Commercial Applications of High Power Picosecond Lasers

Commercial Applications of High Power Picosecond Lasers

…multiple axis workstation this can be removed. 1mm 200µm 50µm50µm Figure 6. High quality sidewall in glass drilled using 10 µJ, 355 nm pulses. Figure 5. High quality 440 µm deep holes in glass drilled using 10 µJ, 355 nm pulses. 500µm Figure 7. 2mm square micromilled area in pyrex using 355nm…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…be drilled in glass with precise depth control. The photo shows 35 µm diameter vias drilled in glass. Vias of this size and quality simply couldn't be produced with a CO2 laser in glass. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 1: a 50 µm-thick glass substrate drilled

Title, arial 28pt Bold

Title, arial 28pt Bold

…AM-OLED · Annealing Glass substrates · Cutting, Drilling and Patterning Glass with ITO Prism Sheet Case Features Touchscreen · Scribing Light guide plate Glass substrates · Laser Frit Sealing Hermetically seals OLED patterned layer between glass substrates Multi-layer PCB Glass substrate with p-Si…

Title, arial 28pt Bold

Title, arial 28pt Bold

…AM-OLED · Annealing Glass substrates · Cutting, Drilling and Patterning Glass with ITO Prism Sheet Case Features Touchscreen · Scribing Light guide plate Glass substrates · Laser Frit Sealing Hermetically seals OLED patterned layer between glass substrates Multi-layer PCB Glass substrate with p-Si…

Title, arial 28pt Bold

Title, arial 28pt Bold

…AM-OLED · Annealing Glass substrates · Cutting, Drilling and Patterning Glass with ITO Prism Sheet Case Features Touchscreen · Scribing Light guide plate Glass substrates · Laser Frit Sealing Hermetically seals OLED patterned layer between glass substrates Multi-layer PCB Glass substrate with p-Si…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

Photonics Spectra - September 2015

Photonics Spectra - September 2015

…is drilling for glass interposers used in 2.5D and 3D advanced circuit packaging techniques. This application takes advantage of both the superior focusability and lower absorption of 5-µm light in glass. Specifically, it enables very small holes to be drilled in glass with…

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