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13 - 24 of 185 Products for 'glass drilling' Page 2 of 16 |

glass drilling

AVIA LX

AVIA LX

…LX Compact DPSS lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates…

MATRIX QS DPSS Lasers

MATRIX QS DPSS Lasers

…Accessories Applications Application Process Material Materials Processing Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card…

DIAMOND J-Series

DIAMOND J-Series

…marking, engraving, cutting, perforating and drilling. The long wave infrared output of these CO2 lasers makes them compatible with numerous organic materials, including paper, cardboard, plastic films, textiles, leather, wood, plastics, and carbon composites, as well as glass and even thin metals.

LPXpro

LPXpro

…reliability and low cost of ownership, make LPXpro lasers suitable for a wide range of demanding, high-precision processing tasks. These include drilling, pulsed laser deposition (PLD), laser direct patterning (LDP), laser lift off (LLO), and cleaning. Model Name Wavelength (nm) Max. Pulse Frequency…

(No Title Available)

(No Title Available)

…of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. Data Sheet Diamond J-3-5 CO Laser DF-Series Fiber-Coupled Multi-Kilowatt…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…Whitepaper February 10th , 2017 www.coherent.com | tech.sales@coherent.com | 800-527-3786 | 408-764-4983 method cannot process strengthened glass, and the edges typically show significant chipping from about 10 m to 50 µm from the processed edge. Figure 4. Bottom-up processing of through-holes…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…contour. Processing speeds for this type of ablation are relatively slow compared to other methods. For example, it takes about 1 second to drill a 1 mm diameter hole in 3 mm thick soda lime glass. The cutting speed for free contours is in the single digit mm/s range. Other drawbacks are that this

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…contour. Processing speeds for this type of ablation are relatively slow compared to other methods. For example, it takes about 1 second to drill a 1 mm diameter hole in 3 mm thick soda lime glass. The cutting speed for free contours is in the single digit mm/s range. Other drawbacks are that this

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…be drilled in glass with precise depth control. The photo shows 35 µm diameter vias drilled in glass. Vias of this size and quality simply couldn't be produced with a CO2 laser in glass. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 1: a 50 µm-thick glass substrate drilled

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…be drilled in glass with precise depth control. The photo shows 35 µm diameter vias drilled in glass. Vias of this size and quality simply couldn't be produced with a CO2 laser in glass. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 1: a 50 µm-thick glass substrate drilled

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