…generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic, and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. Collimating Units Collimating Units The function of this optics…
…Accessories Applications Application Process Material Materials Processing Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card…
…lasers is ideal for ultra-fine processing of materials with little or no heat affected zone (HAZ). Target materials for these lasers include glass, OLED, IC packages/wafers, and flexible thin films. Monaco: Up to 80 µJ/pulse at 60 W in 10 W average power at 100 kHz to enable high throughput…
…marking, engraving, cutting, perforating and drilling. The long wave infrared output of these CO2 lasers makes them compatible with numerous organic materials, including paper, cardboard, plastic films, textiles, leather, wood, plastics, and carbon composites, as well as glass and even thin metals.
…and Medical Applications A new generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. Data Sheet Diamond J-3-5 CO Laser
…(50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and PTFE-based dielectrics and copper. Related Products AVIA NX HyperRapid NX…
…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…
…Whitepaper February 10th , 2017
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method cannot process strengthened glass, and the edges typically show significant chipping from
about 10 m to 50 µm from the processed edge.
Figure 4. Bottom-up processing of…
…laser in glass.
As Vias Shrink, Opportunities for Laser Drilling Expand
Figure 1: A 50 µm-thick glass substrate drilled with successively more pulses from a CO laser
demonstrates the ability of this source to drill glass interposers. CO
drilling of this…
…setup for parallel
drilling through vias in thin glass.
Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass.
Entrance side (A), exit side (B) and side view (C). 700
Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side
…is drilling for glass interposers used
in 2.5D and 3D advanced circuit packaging
techniques. This application takes advantage of both the superior focusability and
lower absorption of 5-µm light in glass.
Specifically, it enables very small holes to
be drilled in glass with…
…generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. While CO lasers were first developed decades ago, practical…
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