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13 - 24 of 188 Products for 'glass drilling' Page 2 of 16 |

glass drilling

DIAMOND E-Series

DIAMOND E-Series

…making it uniquely suited for use in space-sensitive applications involving converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board…

AVIA LX 355-20 Laser | Coherent

AVIA LX 355-20 Laser | Coherent

…LX Compact DPSS lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates…

250 kHz Ultrafast Amplifiers

250 kHz Ultrafast Amplifiers

…generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic, and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. Collimating Units Collimating Units The function of this optics…

MATRIX Family of Q-Switch Lasers | Coherent

MATRIX Family of Q-Switch Lasers | Coherent

…Accessories Applications Application Process Material Materials Processing Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card…

Femtosecond Lasers

Femtosecond Lasers

…lasers is ideal for ultra-fine processing of materials with little or no heat affected zone (HAZ). Target materials for these lasers include glass, OLED, IC packages/wafers, and flexible thin films. Monaco: Up to 80 µJ/pulse at 60 W in 10 W average power at 100 kHz to enable high throughput…

DIAMOND J-Series Lasers

DIAMOND J-Series Lasers

…marking, engraving, cutting, perforating and drilling. The long wave infrared output of these CO2 lasers makes them compatible with numerous organic materials, including paper, cardboard, plastic films, textiles, leather, wood, plastics, and carbon composites, as well as glass and even thin metals.

(No Title Available)

(No Title Available)

…and Medical Applications A new generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. Data Sheet Diamond J-3-5 CO Laser

Microelectronics

Microelectronics

…(50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and PTFE-based dielectrics and copper. Related Products AVIA NX HyperRapid NX…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…Whitepaper February 10th , 2017 www.coherent.com | tech.sales@coherent.com | 800-527-3786 | 408-764-4983 method cannot process strengthened glass, and the edges typically show significant chipping from about 10 m to 50 µm from the processed edge. Figure 4. Bottom-up processing of through-holes…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…contour. Processing speeds for this type of ablation are relatively slow compared to other methods. For example, it takes about 1 second to drill a 1 mm diameter hole in 3 mm thick soda lime glass. The cutting speed for free contours is in the single digit mm/s range. Other drawbacks are that this

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