Ask a Question
Coherent
Search Results
25 - 36 of 185 Products for 'glass drilling' Page 3 of 16 |

glass drilling

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

Photonics Spectra - September 2015

Photonics Spectra - September 2015

…is drilling for glass interposers used in 2.5D and 3D advanced circuit packaging techniques. This application takes advantage of both the superior focusability and lower absorption of 5-µm light in glass. Specifically, it enables very small holes to be drilled in glass with…

Photonics Spectra - September 2015

Photonics Spectra - September 2015

…is drilling for glass interposers used in 2.5D and 3D advanced circuit packaging techniques. This application takes advantage of both the superior focusability and lower absorption of 5-µm light in glass. Specifically, it enables very small holes to be drilled in glass with…

Photonics Spectra - September 2015

Photonics Spectra - September 2015

…is drilling for glass interposers used in 2.5D and 3D advanced circuit packaging techniques. This application takes advantage of both the superior focusability and lower absorption of 5-µm light in glass. Specifically, it enables very small holes to be drilled in glass with…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…becoming popular, require microvias that are beyond the capabilities of mechanical drills. In AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 3: excimer laser (193 nm) vias drilled into glass. a) the 25 µm diameter entrance hole; B) the exit hole; and c) the cross-sectional…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…becoming popular, require microvias that are beyond the capabilities of mechanical drills. In AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 3: excimer laser (193 nm) vias drilled into glass. a) the 25 µm diameter entrance hole; B) the exit hole; and c) the cross-sectional…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…becoming popular, require microvias that are beyond the capabilities of mechanical drills. In AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 3: excimer laser (193 nm) vias drilled into glass. a) the 25 µm diameter entrance hole; B) the exit hole; and c) the cross-sectional…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…excellent option - see side-bar. 2.2. Successful TGV Drilling In the studies described here, we test drilled numerous different glass samples comprising several different thin borosilicate glass wafers and several different alkali-free flat glass wafers, with thicknesses of 100, 50 and 30 µm. We…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…excellent option - see side-bar. 2.2. Successful TGV Drilling In the studies described here, we test drilled numerous different glass samples comprising several different thin borosilicate glass wafers and several different alkali-free flat glass wafers, with thicknesses of 100, 50 and 30 µm. We…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…excellent option - see side-bar. 2.2. Successful TGV Drilling In the studies described here, we test drilled numerous different glass samples comprising several different thin borosilicate glass wafers and several different alkali-free flat glass wafers, with thicknesses of 100, 50 and 30 µm. We…

Powered by Site Search powered by SLI Systems

Call 1-800-227-8840


Outside the U.S. 1-408-764-4983

Coherent has locations across the globe that are available to provide support for any product, service or inquiry.

Visit our Contact Page to connect with any of our global sites.


Corporate Headquarters
Coherent Inc.
5100 Patrick Henry Drive
Santa Clara, CA 95054 USA

email: tech.sales@coherent.com

Send Us a Message

Please Read Before Continuing

Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.


I have read the terms and conditions