…light weight with common interfacing for all models for easy integration APPLICATIONS · Cutting and drilling of glass, sapphire, ceramics and other brittle materials and composites · Cutting, drilling, selective removal of complex composite structures from dissimilar materials, including oxides,…
…result is a very
high bend strength for the glass. Furthermore, CO laser cutting of thin glass
is also performed with a round beam,
allowing radial (free form) cutting of
curves and other shapes.
Hole drilling in glass
So-called "3D packaging" is an important emerging…
…interfacing as standard HyperRapid NX to allow straightforward integration · Right of use to the Coherent SmartCleave IP is included APPLICATIONS · Cutting of strengthened and unstrengthened glass, sapphire, and ceramics · Scribing and drilling of glass, sapphire, ceramics, and composite materials
…that produced a fluence of 7J/cm2 at the work surface. The 193nm wavelength was chosen because glass exhibits strong absorption at this wavelength. FIGURE 1. Excimer laser (193nm) vias drilled into glass: The 25µm diameter entrance hole (a), the exit hole (b), and the cross-sectional view (c).
…blind vias using a simple,
three-pulse process. The first pulse drills
through the overlying copper, which has
a black oxide coating on it to make it absorb infrared (IR). The second pulse drills
through the glass resin board substrate material, which absorbs IR. The final pulse…
…making it uniquely suited for use in space-sensitive applications involving converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board…
…and hole drilling in glass and
sapphire, the Helios laser offers advantages over both
nanosecond and even shorter pulse, ultrafast lasers.
Once again, the advantage over longer pulsewidth
lasers is cut quality. Specifically, this laser produces a
cleaner drilled hole, with…
…capability for increased ablation rate · Efficient micromachining in multiple beam work stations HyperRapid 50 Applications: · Cutting and drilling of glass, sapphire, ceramics and other tough materials, also composites · Micromachining and structuring of large surfaces with line focusing or…
…of carbon monoxide (CO) lasers offer enhanced processing characteristics for materials
processing applications ranging from glass cutting and via drilling, to
fractional skin resurfacing.
HighLight FAP system: diode laser for
plastic welding and soldering
8 Industrial Photonics October 2014 www.IndPhotonics.com In several industries, an increasing need exists to cut, drill and mark glass, sapphire and diamond - materials that are difficult to machine using traditional mechanical methods due to their brittleness and hardness. Their transparency at…
…signifcant glass application is
micro-hole drilling, such as that required in
interposers for 3D circuit packaging. This
application again takes advantage of both
the focusability and controlled light-material interaction. Here, very small holes can be
drilled with depth…
…version · AOM process shutter · Efficient micromachining in multiple beam work stations HYPER RAPID 100 Applications: · Cutting and drilling of strengthened glass, sapphire, ceramics and other tough materials, also composites · Micromachining and structuring of large surfaces with line foci or…
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