…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…
…Whitepaper February 10th , 2017
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method cannot process strengthened glass, and the edges typically show significant chipping from
about 10 m to 50 µm from the processed edge.
Figure 4. Bottom-up processing of…
…laser in glass.
As Vias Shrink, Opportunities for Laser Drilling Expand
Figure 1: A 50 µm-thick glass substrate drilled with successively more pulses from a CO laser
demonstrates the ability of this source to drill glass interposers. CO
drilling of this…
…setup for parallel
drilling through vias in thin glass.
Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass.
Entrance side (A), exit side (B) and side view (C). 700
Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side
…is drilling for glass interposers used
in 2.5D and 3D advanced circuit packaging
techniques. This application takes advantage of both the superior focusability and
lower absorption of 5-µm light in glass.
Specifically, it enables very small holes to
be drilled in glass with…
…generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. While CO lasers were first developed decades ago, practical…
…light weight with common interfacing for all models for easy integration APPLICATIONS · Cutting and drilling of glass, sapphire, ceramics and other brittle materials and composites · Cutting, drilling, selective removal of complex composite structures from dissimilar materials, including oxides,…
…result is a very
high bend strength for the glass. Furthermore, CO laser cutting of thin glass
is also performed with a round beam,
allowing radial (free form) cutting of
curves and other shapes.
Hole drilling in glass
So-called "3D packaging" is an important emerging…
…interfacing as standard HyperRapid NX to allow straightforward integration · Right of use to the Coherent SmartCleave IP is included APPLICATIONS · Cutting of strengthened and unstrengthened glass, sapphire, and ceramics · Scribing and drilling of glass, sapphire, ceramics, and composite materials
…that produced a fluence of 7J/cm2 at the work surface. The 193nm wavelength was chosen because glass exhibits strong absorption at this wavelength. FIGURE 1. Excimer laser (193nm) vias drilled into glass: The 25µm diameter entrance hole (a), the exit hole (b), and the cross-sectional view (c).
…blind vias using a simple,
three-pulse process. The first pulse drills
through the overlying copper, which has
a black oxide coating on it to make it absorb infrared (IR). The second pulse drills
through the glass resin board substrate material, which absorbs IR. The final pulse…
…making it uniquely suited for use in space-sensitive applications involving converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board…
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