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glass drilling

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…be drilled in glass with precise depth control. The photo shows 35 µm diameter vias drilled in glass. Vias of this size and quality simply couldn't be produced with a CO2 laser in glass. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 1: a 50 µm-thick glass substrate drilled

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…Whitepaper February 10th , 2017 www.coherent.com | tech.sales@coherent.com | 800-527-3786 | 408-764-4983 method cannot process strengthened glass, and the edges typically show significant chipping from about 10 m to 50 µm from the processed edge. Figure 4. Bottom-up processing of through-holes…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…Whitepaper February 10th , 2017 www.coherent.com | tech.sales@coherent.com | 800-527-3786 | 408-764-4983 method cannot process strengthened glass, and the edges typically show significant chipping from about 10 m to 50 µm from the processed edge. Figure 4. Bottom-up processing of through-holes…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…contour. Processing speeds for this type of ablation are relatively slow compared to other methods. For example, it takes about 1 second to drill a 1 mm diameter hole in 3 mm thick soda lime glass. The cutting speed for free contours is in the single digit mm/s range. Other drawbacks are that this

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…contour. Processing speeds for this type of ablation are relatively slow compared to other methods. For example, it takes about 1 second to drill a 1 mm diameter hole in 3 mm thick soda lime glass. The cutting speed for free contours is in the single digit mm/s range. Other drawbacks are that this

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…be drilled in glass with precise depth control. The photo shows 35 µm diameter vias drilled in glass. Vias of this size and quality simply couldn't be produced with a CO2 laser in glass. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 1: a 50 µm-thick glass substrate drilled

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…be drilled in glass with precise depth control. The photo shows 35 µm diameter vias drilled in glass. Vias of this size and quality simply couldn't be produced with a CO2 laser in glass. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle Figure 1: a 50 µm-thick glass substrate drilled

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…mask projection setup for parallel drilling through vias in thin glass. Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass. Entrance side (A), exit side (B) and side view (C). 700 pulses total. Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side (A), exit side (B)…

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