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glass drilling

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…Whitepaper February 10th , 2017
www.coherent.com | tech.sales@coherent.com | 800-527-3786 | 408-764-4983
method cannot process strengthened glass, and the edges typically show significant chipping from
about 10 m to 50 µm from the processed edge.
Figure 4. Bottom-up processing of…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…laser in glass.
As Vias Shrink, Opportunities for Laser Drilling Expand
article
Figure 1: A 50 µm-thick glass substrate drilled with successively more pulses from a CO laser
demonstrates the ability of this source to drill glass interposers. CO
2
drilling of this…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…setup for parallel
drilling through vias in thin glass.
Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass.
Entrance side (A), exit side (B) and side view (C). 700
pulses total.
Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance side
(A),…

Photonics Spectra - September 2015

Photonics Spectra - September 2015

…is drilling for glass interposers used
in 2.5D and 3D advanced circuit packaging
techniques. This application takes advantage of both the superior focusability and
lower absorption of 5-µm light in glass.
Specifically, it enables very small holes to
be drilled in glass with…

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

…generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. While CO lasers were first developed decades ago, practical…

COHR HyperRapidNX DS 0618 1.pdf

COHR HyperRapidNX DS 0618 1.pdf

…light weight with common interfacing for all models for easy integration APPLICATIONS · Cutting and drilling of glass, sapphire, ceramics and other brittle materials and composites · Cutting, drilling, selective removal of complex composite structures from dissimilar materials, including oxides,…

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…result is a very
high bend strength for the glass. Furthermore, CO laser cutting of thin glass
is also performed with a round beam,
allowing radial (free form) cutting of
curves and other shapes.
Hole drilling in glass
So-called "3D packaging" is an important emerging…

COHR HRNX SmartCleave DS 0718 3.pdf

COHR HRNX SmartCleave DS 0718 3.pdf

…interfacing as standard HyperRapid NX to allow straightforward integration · Right of use to the Coherent SmartCleave IP is included APPLICATIONS · Cutting of strengthened and unstrengthened glass, sapphire, and ceramics · Scribing and drilling of glass, sapphire, ceramics, and composite materials

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…that produced a fluence of 7J/cm2 at the work surface. The 193nm wavelength was chosen because glass exhibits strong absorption at this wavelength. FIGURE 1. Excimer laser (193nm) vias drilled into glass: The 25µm diameter entrance hole (a), the exit hole (b), and the cross-sectional view (c).

Laser Focus World - August 2016

Laser Focus World - August 2016

…blind vias using a simple,
three-pulse process. The first pulse drills
through the overlying copper, which has
a black oxide coating on it to make it absorb infrared (IR). The second pulse drills
through the glass resin board substrate material, which absorbs IR. The final pulse…

COHR DIAMOND E-1000 DS 0817 1.pdf

COHR DIAMOND E-1000 DS 0817 1.pdf

…making it uniquely suited for use in space-sensitive applications involving converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board…

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