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1 - 12 of 14 Products for 'glass drilling' Page 1 of 2 |

glass drilling

CO Laser - 5µm

CO Laser - 5µm

…generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. Contact Us About This Product Close PRICE HERE Fully Sealed…

META 2C | Laser Cutting and Machining Tool | Coherent

META 2C | Laser Cutting and Machining Tool | Coherent

…cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives Ceramic Plastic --> Features & Benefits META 2C Processing Capabilities:
*…

HYPER RAPID

HYPER RAPID

…Drawing HR 100 Mechanical Drawing Applications Application Process Material Glass Cutting & Drilling Ink-Jet Nozzle Drilling TCO Structuring µ-via drilling Printing & Embossing Tools Printing 3D Contour Mapping Glass Ceramic Sapphire --> Features & Benefits
* 50W/100W at 1064 nm and 1000 kHz…

AVIA NX

AVIA NX

…are singulating PCBs, drilling vias, scribing photovoltaics or micromachining metals, AVIA NX lasers are better than ever and better than the competition. Datasheet AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic…

HyperRapid NX - Industrial Picosecond Laser

HyperRapid NX - Industrial Picosecond Laser

HyperRapid NX The HyperRapid NX industrial picosecond laser system is designed and manufactured for 24/7 operation in a variety of environmental conditions. High average power operation at >100 W across a wide range of repetition rates up to 1 MHz, allows for high throughput micro-machining with the…

The Monaco diode-pumped femtosecond industrial laser

The Monaco diode-pumped femtosecond industrial laser

…Application Process Material Complex Layer Processing Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel --> Features…

IndyStar

IndyStar

…1 kHz 248 1000 12 12 IndyStar 2 kHz 2000 6 Datasheet IndyStar Applications Application Material Photomask Inspection Ink-Jet Nozzle Drilling Semiconductor Glass Plastic --> Features & Benefits IndyStar Key Feature Customer Benefit Semi-S2 Certified Design High uptime Corona Preionization Stable,…

META 1.5C | Compact and Flexible Laser Cutter | Coherent

META 1.5C | Compact and Flexible Laser Cutter | Coherent

…cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic ABS Ceramic --> Features & Benefits META 1.5C Processing Capabilities:
*…

LAMBDA SX

LAMBDA SX

…Application Process Material Ink-Jet Nozzle Drilling 3D-Structuring Roll-To-Roll Circuit Patterning Pulsed Laser Deposition Automotive Cylinder Hardening Excimer Laser Annealing Sequential Lateral Solidification Ablation-Material Removal Ceramic Glass Polymer Plastic Metal Semiconductor --> Features…

LEAP

LEAP

…Process Material 3D-Structuring Etch Barrier Patterning Ink-Jet Nozzle Drilling Roll-To-Roll Circuit Patterning Diamond Like Carbon Coating Pulsed Laser Deposition Ablation-Material Removal Ceramic Polymer Glass Semiconductor Plastic Metal Composite --> Features & Benefits LEAP Features…

DIAMOND E-Series

DIAMOND E-Series

…making it uniquely suited for use in space-sensitive applications involving converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board…

AVIA LX

AVIA LX

…LX Compact DPSS lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates…

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