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1 - 9 of 9 Products for 'indium foil' Page 1 of 1 |
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indium foil

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

Book.book

Book.book

…thermal conduction is required, the only recommended thermal conductance aids are pyrolytic graphite pads or thermal materials, such as Sil-Pad or Indium foil. Thermal compound or any flowable compound that can enter into screw openings is not recommended. Refer to Figure 3-2 (p. 3-3) for heat sink…

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