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1 - 10 of 61 Search Results for laser dicing

1pdf document  Semi LasersTargetChipFabricationRev2 Best match in this PDF  |  All matches in this PDF
…create a production bottleneck. Laser dicing and scribing Where thinner wafers pose challenges to mechanical saws, they provide opportunities for photonic cutting tools; the thinner the wafer, the faster a laser can dice it. Research has demonstrated that lasers can dice wafers less than 150 µm thick…
Related Searches: silicon drilling | diode-pumped solid-state | dicing led

2pdf document  productronic Coherent approved Best match in this PDF  |  All matches in this PDF
…using the laser to cut completely through the wafer - referred to as laser dicing. Overall cost parity between lasers and sawing can be expected for wafer thickness below 100 microns, with the advantage to laser processing at 50 microns and less. Currently, q-switched, DPSS UV (355 nm) lasers like the…
Related Searches: ito patterning | avia 355 | 355-20

3Coherent Inc. Si Wafer Scribing, Cutting and Dicing with Lasers
Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high volume production and in the development of tomorrow’s advanced chip architectures. Find the Laser Solution that Fits your Application Needs. Search Applications…

4pdf document  AdvancedUVMay2009 Best match in this PDF  |  All matches in this PDF
…every laser pulse: both energy and timing. The exceptional optical performance of Matrix uV lasers directly impacts the quality of parts stereolithography can deliver, as well as its economics. This is because the maximum horizontal writing resolution is directly dependent upon the laser's beam quality…
Related Searches: oven | uv diode laser | paladin advanced 355 | laser lift off

5058-061 Production_Tech  (PAGE 3 OF 4)
60
of the electronics industry."
Laser micromachining
within the semiconductor
industry can be divided
into two main areas: dicing/scribing/cutting and
via drilling. The maturity of via-drilling in
the packaging industry to provide compact
interconnects in 3D…

6pdf document  Talisker Sapphire Scribing Whitepaper final Best match in this PDF  |  All matches in this PDF
…area of singulation, that is, the process of dicing a wafer containing many LEDs into individual devices. Traditionally, this has been accomplished using either mechanical means or laser ablation based Q-switched, diode-pumped, solid-state (DPSS) lasers. However, both these approaches have limitations…
Related Searches: talisker | dicing led | 213 nm | sapphire wafer

7Coherent Inc. MATRIX QS DPSS Lasers enable Materials Processing
…-pumped, solid-state, Q-switch lasers, with output powers up to 10W at 1064 nm, 14W at 532 nm and up to 2W at 355 nm. UV Micromachining: Shorter Pulses or Shorter Wavelength For many medical devices, cost-effective state-of the-art micromachining can be obtained by using a laser with short output pulses and…
Related Searches: 1064 532 | matrix uv | 355 nm diode | matrix 355-1-60

8Coherent Inc. MATRIX Family of DPSS Q-Switched and CW DPSS Laser
lasers enable a wide range of applications: * Marking * Cutting * Dicing * Drilling * Engraving * Marking * Memory Repair * Stereolithography * Scribing * Thin Film Patterning * Trimming Related Applications . -- Select a Related Application -- IC Package Marking with a Diode-Pumped Solid-State Laser
Related Searches: matrix laser | dpss 532 | matrix 1064 | q-switch

9Coherent Feature.qxd  (PAGE 2 OF 3)
…production bottleneck.
Laser dicing and scribing
Where thinner wafers pose challenges to mechanical saws, they provide opportunities for photonic cutting tools; the thinner the wafer, the
faster a laser can dice it. Research
has demonstrated that lasers can
dice wafers less than 150…
Related Searches: sapphire wafer | dicing led

10Coherent Inc. AVIA Family of DPSS Lasers for Micromachining
…Circuit Machining Glass Cutting and Scribing Laser Direct Patterning LED Processing Marking, Engraving and Coding Microvia Drilling in PCBs Semiconductor Manufacturing Semiconductor Manufacturing with Excimer Lasers Si Wafer Scribing, Cutting and Dicing Solar Thin-Film Patterning Technical Notes .…
Related Searches: avia | 355 nm cw | 355 nm laser | laser mirror parts


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