1 - 10 of 423 Search Results for laser scribing
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1.
Solar_Cell_Scribing_AILU_1207.pdf
(PAGE 1 OF 2)
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…
in series. This subdivision and connector
patterning requires that the panel be scribed
after each of the layers is deposited. For
glass substrates, visible wavelength lasers
can even scribe from the rear surface (through
the glass).
Edge (Border) Deletion
For thin…
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3.
Coherent Inc. Lasers Drive LED Processing
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…Novel laser based manufacturing concepts such as laser lift off (LLO) processing with 193 nm and 248 nm excimer lasers enable vertical LED structures with increased light extraction efficiency. Laser based sapphire scribing as well as wafer or substrate dicing with diode pumped solid state lasers at 266…
Related Searches: laser lift-off | sapphire scribing
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5.
Coherent Inc. Low k Dielectric Scribing with UV DPSS Lasers
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Low-k Dielectric Scribing with UV DPSS Lasers Find the Laser Solution that Fits your Application Needs. Search Applications Notes Search by material and/or process. -- SELECT MATERIAL -- Ceramic Composite Diamond Fabric and Leather Glass Metal Paper Plastic Semiconductor Wood and Derivatives -- SELECT…
Related Searches: low-k
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6.
Talisker_Sapphire_Scribing_Whitepaper_final.pdf
(PAGE 1 OF 3)
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…mechanical methods for sapphire wafer singulation are
diamond scribing and blade dicing. Unfortunately, when
using these methods, the low depth of the scribe can
lead to failure of the substrate to break along the
scribed line, which lowers yields. The major negatives
of blade dicing…
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9.
Talisker_Sapphire_Scribing_Whitepaper_final.pdf
(PAGE 1 OF 3)
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…mechanical methods for sapphire wafer singulation are
diamond scribing and blade dicing. Unfortunately, when
using these methods, the low depth of the scribe can
lead to failure of the substrate to break along the
scribed line, which lowers yields. The major negatives
of blade dicing…
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