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laser lift off

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…the laser initiated detachment occurs at the glass/adhesive interface. After laser debonding, the glass substrate is lifted off the thinned wafer, leaving some residual adhesive which is then removed using solvents. The Excimer Laser Advantage The most important advantage of 308 nm excimer laser

Laser Focus World - November 2017

Laser Focus World - November 2017

…rectangular output of the excimer laser is homogenized and reshaped into a long, thin line typically having a length that is equal to the width (or half the width), of the panel. This allows the entire panel to be processed in one (or two, respectively) passes under the laser beam, which is critical…

Preinstallation Manual Paladin Advanced Mode Locked UV Laser System

Preinstallation Manual Paladin Advanced Mode Locked UV Laser System

…(arrow down) to confirm the error message and to turn off the red LED. After sufficient coolant has been added, press the ON/OFF button (arrow up) to start the chiller. 6. Confirm that there are no leaks at the water connection sites on the laser head and the chiller. Correct any leaks. 7. When the…

DIAMOND J-5 Series OEM Lasers Preinstallation Manual Rev AA

DIAMOND J-5 Series OEM Lasers Preinstallation Manual Rev AA

…sufficiently large enough to uncrate laser [ ] Forklift or pallet jack capable of moving the fully loaded crate (77 kg/170 lbs.) [ ] Forklift or hoist capable of lifting the 58 kg (127 lbs.) laser off shipping pallet [ ] Cart capable of moving 58 kg (127 lbs.) laser to installation area "Receive and…

00 E-1000 PreInst.book

00 E-1000 PreInst.book

DIAMOND E-1000 Series OEM Lasers Preinstallation Manual 26 2. Lift up and pull off to remove top the top cover (Figure 8). Figure 8. Top Cover Removed

COHR ExcimerCatalog2016revC.pdf

COHR ExcimerCatalog2016revC.pdf

Superior Reliability & Performance · www.Coherent.com · tech.sales@coherent.com6 Applications Matrix1 Marking Polymer,TeflonMarking · · · · VisibleandInvisibleMarking(EyeglassMarking,etc.) · · · · DiamondandJewelMarking · Material Processing PolymerDrilling(InkjetNozzle,Filter) · · · ·…

ILS Annealing.PDF

lasers to produce high-energy UV pulses is also benefiting other applications in displays and microelectronics manufacturing. For example, excimer lasers are used in mask-based direct patterning of microcircuits for cost-sensitive applications like medical disposables. Here, the excimer laser is…

Picosecond laser

Picosecond laser

…"List of Faults") FACK INT 1 1 -- Acknowledge and clear fault codes Send "FACK=1" to acknowledge faults and return the laser to a ready state if the fault condition is lifted ?FAULTS STR -- Return a list of all fault codes Returns a list of all possible fault and warnings with their numbered codes…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…of the laser energy is wasted (since the line goes off the edge of the wafer when the line is anywhere except the very center of the wafer). Conversely, the step-and-repeat method requires less laser power, yet is still capable of reaching up to 40 wafers/hour throughput even at low laser pulse…

Picosecond laser

Picosecond laser

…"List of Faults") FACK INT 1 1 -- Acknowledge and clear fault codes Send "FACK=1" to acknowledge faults and return the laser to a ready state if the fault condition is lifted ?FAULTS STR -- Return a list of all fault codes Returns a list of all possible fault and warnings with their numbered codes…

Picosecond laser

Picosecond laser

…"List of Faults") FACK INT 1 1 -- Acknowledge and clear fault codes Send "FACK=1" to acknowledge faults and return the laser to a ready state if the fault condition is lifted ?FAULTS STR -- Return a list of all fault codes Returns a list of all possible fault and warnings with their numbered codes…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…the laser initiated detachment occurs at the glass/adhesive interface. After laser debonding, the glass substrate is lifted off the thinned wafer, leaving some residual adhesive which is then removed using solvents. The Excimer Laser Advantage The most important advantage of 308 nm excimer laser

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