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1 - 10 of 49 Search Results for sapphire scribing

1pdf document  SemiManufMagRev2 Best match in this PDF  |  All matches in this PDF
…that particularly benefit from laser cutting are thin silicon wafers, compound semiconductors and components on sapphire substrates, such as GaN blue LEDs. Most current laser wafer scribing is performed with allsolid-state lasers operating at either 1064 nm or 355 nm. These lasers are proven to deliver…
Related Searches: wafer inspection | indigo | 257 nm laser

2Coherent Inc. Applications Finder
…machined with high resolution (more Sapphire Scribing with Diode-Pumped Solid-State Lasers Single-crystal sapphire is a popular substrate for epitaxial growth of a number of cutting edge optoelectronic devices, such as blue-green LEDs and laser diodes. However, sapphire is a hard material so device singulation…
Related Searches: amoled | diode-pumped solid-state

3pdf document  nphoton.2006.95 Best match in this PDF  |  All matches in this PDF
scribes LED wafers with cuts as small as 2.5 m, leading to up to 24% more die per wafer and providing typical yields greater than 99% at less than $2 per wafer. For standard 2-inch blue LED wafers, it provides a throughput of up to five wafers per hour. It can scribe up to 6-inch wafers, including sapphire
Related Searches: sapphire windows | 266nm cw laser | diode-pumped solid-state

4Coherent Inc. Sapphire Scribing with Diode Pumped Solid State Lasers
…Passes. Comments: Laser scribing of sapphire with a Q-switched, ultraviolet laser is a high-precision, non-contact process, which addresses concerns about street width restrictions and chip-edge damage. Specifically, we have shown that laser scribes can readily achieve scribe aspect ratios substantially…
Related Searches: sapphire | laser scribing | laser cleaving

5pdf document  pdf 232 Best match in this PDF  |  All matches in this PDF
…This improvement will allow cutting kerfs down to a width of 20 microns. With these improvements, cutting or scribing of transparent materials such as polymers, glass, diamonds, and sapphire, will become more efficient. For the semiconductor industry for example, a UV laser can cut silicon wafers covered…
Related Searches: excimer pumped dye laser | ns laser | krf laser | lambda physik dye laser

6pdf document  AdvancedUVMay2009 Best match in this PDF  |  All matches in this PDF
…that it allows the same laser to perform optimally for both scribing (half-cutting) and dicing (full-cutting). Specifically, the Avia 355-23- 250 can be set to produce relatively low energy pulses at a high repetition rate, in order to scribe through the top layer of circuitry, which is typically about…
Related Searches: uv led | stereolithography | 350 nm | uv 355

7Coherent Inc. Lasers Drive LED Processing
…(LLO) processing with 193 nm and 248 nm excimer lasers enable vertical LED structures with increased light extraction efficiency. Laser based sapphire scribing as well as wafer or substrate dicing with diode pumped solid state lasers at 266 nm and 355 nm or picosecond lasers further reduce production…
Related Searches: laser scribing | laser lift-off

8Coherent Inc. Debonding of GaN and Sapphire Layers with UV Excimer Lasers
Debonding of GaN and Sapphire Layers with UV Excimer Lasers Find the Laser Solution that Fits your Application Needs. Search Applications Notes Search by material and/or process. -- SELECT MATERIAL -- Ceramic Composite Diamond Fabric and Leather Glass Metal Paper Plastic Semiconductor Wood and Derivatives…
Related Searches: laser lift off | laser lift-off | llo

9Coherent Feature.qxd  (PAGE 2 OF 3)
…caused during mechanical dicing stop within the borders of the
laser scribe.
The LED market is lending further
momentum to laser scribing applications. LEDs are grown on high-cost
substrates, such as GaAs, sapphire,
GaP and SiC, that only grow in value
following epitaxy. High…

10AdvancedUVMay2009.pdf  (PAGE 4 OF 4)
…the same laser to perform optimally
for both scribing (half-cutting) and dicing
(full-cutting). Specifically, the Avia 355-23-
250 can be set to produce relatively low energy pulses at a high repetition rate, in order
to scribe through the top layer of circuitry,
which is typically…
Related Searches: laser lift-off


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