1 - 10 of 424 Search Results for scribing
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4.
Coherent Inc. Alumina Drilling and Scribing with CO2 Lasers
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…lines were scribed. Successful scribing was achieved on all samples and 35 to 45% cut depth was achieved on both 0.025" and 0.040" thick samples. This cut depth would be sufficient to produce a clean break in the substrate. Fig. 1 - 1-mm Diameter Holes Were Drilled and 10-mm Long Lines Scribed on Alumina…
Related Searches: k-250 | k250 | glass scribing
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5.
Coherent Inc. Low k Dielectric Scribing with UV DPSS Lasers
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…Results: Laser scribing of a low-k dielectric stack on silicon was performed and the results visualized using a scanning electron microscope. Laser scribing successfully cut through all the dielectric layers, and produced no cracking or delamination. Fig. 1 - An AVIA-X Laser Scribe Line in a Low-k Dielectric…
Related Searches: laser scribing | low-k
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7.
Talisker_Sapphire_Scribing_Whitepaper_final.pdf
(PAGE 2 OF 3)
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…the backside, away from the LEDs themselves. This approach has, to date, been the most economical method for sapphire scribing. Some manufacturers scribe from the front (epitaxy) side, which typically employs a 266 nm, Q-switched DPSS laser. This shorter wavelength minimizes…
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8.
Talisker_Sapphire_Scribing_Whitepaper_final.pdf
(PAGE 2 OF 3)
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…the backside, away from the LEDs themselves. This approach has, to date, been the most economical method for sapphire scribing. Some manufacturers scribe from the front (epitaxy) side, which typically employs a 266 nm, Q-switched DPSS laser. This shorter wavelength minimizes…
Related Searches: laser scribing
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10.
Talisker_Sapphire_Scribing_Whitepaper_final.pdf
(PAGE 1 OF 3)
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…mechanical methods for sapphire wafer singulation are diamond scribing and blade dicing. Unfortunately, when using these methods, the low depth of the scribe can lead to failure of the substrate to break along the scribed line, which lowers yields. The major negatives of blade dicing…
Related Searches: laser scribing
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