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1.    pdf 232 Best match in this PDF  |  All matches in this PDF …improvement will allow cutting kerfs down to a width of 20 microns. With these improvements, cutting or scribing of transparent materials such as polymers, glass, diamonds, and sapphire, will become more efficient. For the semiconductor industry for example, a UV laser can cut silicon wafers covered by a… Related Searches: excimer pumped dye laser | ns laser | krf laser | lambda physik dye laser

2.    Laser Scribing PVI Best match in this PDF  |  All matches in this PDF …happens to be one of many different processes that lasers can perform; others commonly used within the solar industry include drilling, melting, cutting and selective ablation. To be consistent with `non-solar' market segments, and aligned with solarfamiliar terms such as plasma-etching tool or screen… Related Searches: laser scribing of solar panels | cigs | p1 | solar cell scribing

3.    NonMetalRev2 Best match in this PDF  |  All matches in this PDF …and plastic materials. Higher peak powers and pulsed operation mean faster cutting and `cooler' processing. . . . Cutting 1500 watts 500 watts Cooling DIAMOND CW Laser Did you know that DIAMOND CO2 lasers from Coherent can cut most non-metals, while maintaining an exceptional edge-quality, at speeds faster…

4.  Coherent Inc. Silicon Wafer Cutting with DPSS Lasers …Cladding Cutting and Scribing Drilling Heat Treating Marking and Engraving Sub-Surface Modification Surface Modification Welding and Soldering View All Application Notes Summary: Thin silicon wafers were cut at speeds of up to 70mm/sec using a diode-pumped solid-state laser. Single pass cutting was possible… Related Searches: diode-pumped solid-state

5.  Coherent Inc. Si Wafer Scribing, Cutting and Dicing with Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high volume production and in the development of tomorrow’s advanced chip architectures. Find the Laser Solution that Fits your Application Needs. Search Applications… Related Searches: laser dicing | low-k

6.    Semi LasersTargetChipFabricationRev2 Best match in this PDF  |  All matches in this PDF …semiconductor industry implements thinner wafers. These images of a 216-µm-thick silicon wafer, taken with a scanning electron microscope, shows both a laser-cut leading edge and slot (roughly 200 µm). The cutting tool was a 355-nm 7-W solid-state laser operating at a 50-kHz repetition rate. head… Related Searches: silicon drilling | laser dicing | diode-pumped solid-state | avia 355-x

7.    InterPV March 2009 Best match in this PDF  |  All matches in this PDF …cutting makes it easier to produce curved cuts in glass. The demand for glass cutting with curved cuts has featured heavily in mobile phones, where manufacturers sought to replace plastic covers with glass to increase scratch resistance - requiring small radius rounded edges, and sometimes even cut-… Related Searches: laser scribing of solar panels | p1 | k-250 | laser glass cutting

8.  Coherent Inc. Site Map …CO 2 Laser PES Cutting with CO 2 Lasers Plastic Bottle Marking with CO 2 Lasers Plastic Cutting with 100W CO 2 Lasers Plastic Film Slitting with CO 2 Lasers Polyimide Film Cutting with DPSS Lasers Precision Cutting of Stainless Steel with a CO 2 Laser Precision Engraving of Silicon Wafers Pulsed Laser… Related Searches: ultima 2000 | diamond k2k | sapphire windows | ultima 2000 laser

9.    HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2 Best match in this PDF  |  All matches in this PDF …of Silicon Manufacturers that rely on silicon substrates for thermally and electrically stable platforms for semiconductor devices need to be able to cut, drill and perform other machining operations to complete the manufacturing process necessary to produce discrete dies. Diamond saw cutting is a… Related Searches: 355 nm diode | power gator | trepanning head | 355 nm laser

10.  Highlights No. 63 | 12.11.QXP  (PAGE 4 OF 16) …efficient when cutting thin wafers (thickness below 100 microns) because of the constant cooling and high cutting speed. The electronics industry is constantly changing and is very demanding. New optoelectronic devices use glass on silicon or silicon on glass, but a water…

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