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1.    MicromachiningWithTalisker Best match in this PDF  |  All matches in this PDF …silicon with picosecond lasers with wavelengths of 1064 nm, 532 nm and 355 nm. Figure 2 shows a trepanned hole in silicon using 355 nm pulses. A lower throughput is required than for percussion drilling and deeper vias can be drilled at 355 and 532 nm than 1064 nm due to the higher absorption of silicon… Related Searches: glass drilling

2.    ComparisonExcimerLaserSolidStateLaserRev2 Best match in this PDF  |  All matches in this PDF …to be drilled, this implies that only a minute fraction of the laser beam is really needed. Therefore, a useful technique for a more economical use of the laser beam is the drilling of many holes simultaneously. The simplest set-up is shown in Figure 3. Figure 3: Simple set-up for hole drilling with excimer… Related Searches: excimer laser annealing | 193 nm laser | 532 nm laser

3.    BeamShapingLFW05Rev2 Best match in this PDF  |  All matches in this PDF …elements for each axis and delivers energy uniformity of 3% to 5% (at 2 sigma) along both axes. In demanding applications such as inkjet-nozzle drilling or silicon crystallization, uniformity is improved to 1.5% (at 2 sigma) by using up to 18 lenslets. Once a uniform beam has been produced, the next step… Related Searches: beam shaping optics | beam homogenizer | expander

4.    Semi LasersTargetChipFabricationRev2 Best match in this PDF  |  All matches in this PDF …interconnects in silicon entails a plasma etch procedure combined with photolithography, both of which tend to be slow and expensive. Lasers, however, can drill hundreds of microvias per second and can process a wafer in less than 10 minutes. Besides the cost savings, laser drilling can create holes… Related Searches: diode-pumped solid-state | dicing led | avia 355-x

5.    70410-186e-ILS Best match in this PDF  |  All matches in this PDF …site, a 1064nm laser pulse drives the aluminumthroughthepassivationlayerandseveralmicrons deep into the silicon, creating a localized Al/Si alloy. Another fast-growing application is via drilling. The simplest solar cells have contacts on the front and rear surfaces to collect the negative and positive… Related Searches: silicon nitride | p1 | indium foil

6.  058-061 Production_Tech  (PAGE 2 OF 4) …be drilled through the silicon wafers. Not surprisingly, the use of lasers gets prioritized in all discussions surrounding the optimization for production-ready tooling within the industry for WrapThrough cells7), 8) . As explained by Schoonderbeek8) : "Laser drilling is… Related Searches: tsv

7.    HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2 Best match in this PDF  |  All matches in this PDF …trepanned in 680 micron thick silicon with good round geometries. Figure 7b, are percussion drilled holes produced at a rate of over 50 holes per second. Even without trepanning the circularity of these percussion-drilled holes do meet the requirements of many via hole drilling applications. SPIE USE, V… Related Searches: power gator | 532nm pulsed laser | 355 nm laser | sapphire

8.    PrecisionMaterialsProcessingwithTaliskerLasers1 Best match in this PDF  |  All matches in this PDF …typical of laser drilling, as this aids the metal plating process. However, there must be a minimum of melt on the via sidewalls, since the resulting residual stress can result in the wafers literally falling apart. Figure 3. High aspect ratio, percussion drilled hole in silicon drilled with 532 nm pulses… Related Searches: nanosecond | pulse fiber laser | laser glass cutting | glass drilling

9.  MicromachiningWithTalisker.pdf  (PAGE 1 OF 1) …silicon with picosecond lasers with wavelengths of 1064 nm, 532 nm and 355 nm. Figure 2 shows a trepanned hole in silicon using 355 nm pulses. A lower throughput is required than for percussion drilling and deeper vias can be drilled…

10.    InterPV MWT April 2009 Best match in this PDF  |  All matches in this PDF …where holes must be drilled through the silicon wafers. Not surprisingly, the use of lasers gets prioritized in all discussions surrounding the optimization for production-ready tooling within the industry for WrapThrough cells7), 8) . As explained by Schoonderbeek8) : "Laser drilling is a key technology… Related Searches: tsv | solar cell scribing | via drilling

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Search Suggestions: 355 nm laser | excimer laser annealing | beam shaping optics | beam homogenizer | 193 nm laser | 532 nm laser | excimer laser ablation metal | excimer lamp | expander | beam expander

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