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Related Categories: Fr4 Cutting | Wafer Cutting | Dirk Muller

stealth dicing

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…laser (right). The picosecond laser produced a cleaner hole with less recast material and a smaller heat-affected zone (HAZ). Results of stealth dicing a silicon carbide wafer with a picosecond laser, before mechanical separation of the individual dies. Cross sections of glass cut with a nanosecond…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…makes a scribe part way through the wafer, and the individual chips are subsequently singulated mechanically. The second method is called stealth dicing. Here the beam is focused within the wafer itself, where it creates a scribe within the material. Again, the individual chips are then singulated…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…makes a scribe part way through the wafer, and the individual chips are subsequently singulated mechanically. The second method is called stealth dicing. Here the beam is focused within the wafer itself, where it creates a scribe within the material. Again, the individual chips are then singulated…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…laser (right). The picosecond laser produced a cleaner hole with less recast material and a smaller heat-affected zone (HAZ). Results of stealth dicing a silicon carbide wafer with a picosecond laser, before mechanical separation of the individual dies. Cross sections of glass cut with a nanosecond…

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