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1.  MicromachiningWithTalisker.pdf  (PAGE 1 OF 1) …has conducted extensive tests of both percussion drilling and trepanning STVs in silicon using the picosecond output of Talisker; percussion drilling where the spot size matches the via diameter, and trepanning where a small spot cuts the via by scanning in a circular pattern… Related Searches: silicon drilling

2.  Laser Processing- The Future of HDI Manufacturing  (PAGE 9 OF 10) Using trepanning (Figure 9), the laser beam is moved in a spiral fashion to drill holes larger than the laser focal spot. This process leads to slower processing speeds (50-200 microvias/second) than punching. Typically, formation of a 100µm microvia with a UVDPSS laser takes six times longer…

3.    PrecisionMaterialsProcessingwithTaliskerLasers1 Best match in this PDF  |  All matches in this PDF …drilled with 532 nm pulses. There are two ways to use lasers to produce STVs: percussion drilling where the spot size matches the via diameter, and trepanning where a small spot cuts the via by scanning in a circular pattern. Talisker picosecond lasers offer advantages for both applications. With percussion… Related Searches: nanosecond | pulse fiber laser | laser glass cutting | glass drilling

4.    MicromachiningWithTalisker Best match in this PDF  |  All matches in this PDF …applications lab has conducted extensive tests of both percussion drilling and trepanning STVs in silicon using the picosecond output of Talisker; percussion drilling where the spot size matches the via diameter, and trepanning where a small spot cuts the via by scanning in a circular pattern. Results for… Related Searches: silicon drilling | glass drilling

5.    pdf 128 Best match in this PDF  |  All matches in this PDF …trepanning the hole with lower pulse energy and a number of repetitions. In this situation, the relative movement between the laser beam and the material avoids the pressure accumulation in a blind via and therefore reduces the burr formation on the surface. In Figure 2, a 260 µm diameter trepan-drilled… Related Searches: 532 nm pulsed laser | tea co2 laser | third harmonic generation | uv diode laser

6.    LaserProc futureHDIrev2 Best match in this PDF  |  All matches in this PDF …IR CO2 lasers and UV-DPSS lasers exhibit key differences when processing materials through percussion drilling (also referred to as punching), trepanning or removing copper and/or dielectric materials. When punching or percussion drilling microvias in HDIS (Figure 8), the laser beam and the HDI substrate… Related Searches: ir laser | q switched co2 | via drilling | uv diode laser

7.  HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2.pdf  (PAGE 2 OF 9) …scanner system is shown in Figure 1. For drilling precise circular holes the scanner head is replaced with a trepanning system as shown in Figure 2. The main parts of a trepanning system are rotating wedges to shift the laser beam. By rotating the wedges the beam draws a circular path on the… Related Searches: trepanning head

8.    HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2 Best match in this PDF  |  All matches in this PDF …trepanned in silicon. Figure 6b shows the smooth surface quality achieved. In Figure 7a, the 100µm-diameter holes were trepanned in 680 micron thick silicon with good round geometries. Figure 7b, are percussion drilled holes produced at a rate of over 50 holes per second. Even without trepanning the… Related Searches: power gator | 532nm pulsed laser | 355 nm laser | sapphire

9.  HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2.pdf  (PAGE 7 OF 9) …of these holes are being drilled using the trepanning head shown previously in Figure 2. Since steel is less sensitive to laser wavelength holes can be drilled using 1064 nm, as shown in Figure 9, or 532nm or 355nm. Figure 9: Trepanned holes in stainless steel drilled with 1064 nm (picture… Related Searches: trepanning head

10.  Highlights No. 57 zur PDF.QXP  (PAGE 2 OF 8) …the reduced absorption of laser induced plasma compared to IR-wavelength. The drilling process can be done either by percussion or trepanning. With ns-pulses, heat-conducting effects cause a melting of the layer beneath the surface where the laser beam is absorbed. The vapor… Related Searches: tea co2 laser

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Search Suggestions: beam quality factor | green laser | q-switched co2 laser | sapphire | silicon drilling | nanosecond | 532 nm pulsed laser | tea co2 laser | pulse fiber laser | third harmonic generation

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