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Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

…microelectronics devices with higher performance, efficiency as well functional density via reduced package thickness better heat dissipation increased TSV density As a consequence, strong market growth is forecasted for thin wafer shipments (Fig.1) Figure 1: Thin wafer 2011-2017 shipment forecast…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

4 Photonik international · 2013 Originally published in German in Photonik 3/2013 Laser Technology 248 nm photons is limited to the GaN buffer layer closest to the adjacent sapphire and at the typically used laser energy density of 750 mJ/cm2 amounts to about 0.1 µm. To this depth the applied laser…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

4 Photonik international · 2013 Originally published in German in Photonik 3/2013 Laser Technology 248 nm photons is limited to the GaN buffer layer closest to the adjacent sapphire and at the typically used laser energy density of 750 mJ/cm2 amounts to about 0.1 µm. To this depth the applied laser…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…microelectronics devices with higher performance, efficiency as well functional density via reduced package thickness better heat dissipation increased TSV density As a consequence, strong market growth is forecasted for thin wafer shipments (Fig.1) Figure 1: Thin wafer 2011-2017 shipment forecast…

Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

…microelectronics devices with higher performance, efficiency as well functional density via reduced package thickness better heat dissipation increased TSV density As a consequence, strong market growth is forecasted for thin wafer shipments (Fig.1) Figure 1: Thin wafer 2011-2017 shipment forecast…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…microelectronics devices with higher performance, efficiency as well functional density via reduced package thickness better heat dissipation increased TSV density As a consequence, strong market growth is forecasted for thin wafer shipments (Fig.1) Figure 1: Thin wafer 2011-2017 shipment forecast…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

4 Photonik international · 2013 Originally published in German in Photonik 3/2013 Laser Technology 248 nm photons is limited to the GaN buffer layer closest to the adjacent sapphire and at the typically used laser energy density of 750 mJ/cm2 amounts to about 0.1 µm. To this depth the applied laser…

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