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1.  Silicon Wafer Cutting with DPSS Lasers Silicon Wafer Cutting with DPSS Lasers To make it easy for you to access a wide range of commercial applications using lasers, we have developed an Industrial Applications finder’s tool. Coherent lasers & industrial laser applications Semiconductor Cutting and Scribing Ablation-Material Removal ... Related Searches: avia-x | vanadate | avia 10w

2.  Silicon Wafer Dicing and Scribing Silicon Wafer Dicing and Scribing Superior Reliability & Performance Lasers and Laser-based Systems Laser Measurement and Control Precision Optics Related Accessories The AVIA 355-23-250 was specifically designed to address silicon wafer scribing and dicing applications, but also appears to have ... Related Searches: scribing | pico | avia 355-23-250

3.  [index.cfm?fuseaction=Forms.ShowApp1List.cfm&startrow=51] ... Composite Fabric and Leather Glass Metal Paper Plastic Semiconductor Wood and Derivatives -- SELECT PROCESS -- Ablation-Material Removal Cladding Cutting and Scribing Drilling Heat Treating Marking and Engraving Sub-Surface Modification Surface Modification Welding and Soldering View All Application ...

4.  Coherent Inc. ...    Solar Cell (c-Si) Laser Fired Contacts    Solar Cell (c-Si) Via Drilling    Solar Cell (c-Si) Wafer Marking    Solar Cell (Thin Film) Patterning    Solar Laser Solutions    Spectroscopy    Telecom ... Related Searches: ultima 2000 | verdi | ito | 808nm laser diode

5.    pdf_232  (PAGE 4 OF 16) 4 of new shapes and different chip sizes on the same wafer. The system is most efficient when cutting thin wafers (thickness below 100 microns) because of the constant cooling and high cutting speed. The electronics industry is constantly changing and is very demanding. New optoelectronic devices use ...

6.    SemiManufMagRev2  (PAGE 5 OF 5) ... increased output power and reduced package size to enable these lasers to support an even greater range of fabrication-related applications. WAFER SCRIBING Historically, laser wafer scribing has been largely a niche fab technology, unable to be cost-competitive with mechanical sawing. However, several ...

7.    PRISMA_brochureRevA Best match in this PDF  |  All matches in this PDF ... expanders · 'Ready-for-scanner' box · Different mounting interface and wiring configurations Applications · Micromachining Mould Form Manufacturing, Cutting, Drilling, Ablation, Diamond Cutting, Micro-Welding, Micro-Bending · Solar Cell Manufacturing LGBC (Laser Grooved Buried Contacts), Edge Isolation ... Related Searches: thinfilm solar scribing | lgbc

8.    SemiManufMagRev2 Best match in this PDF  |  All matches in this PDF ... -yield management. In addition, lasers are found in a number of metrology applications, including reticle inspection, patterned and unpatterened wafer inspection, film thickness diagnostics, and profiling of high aspect ratio physical structures, such as contact holes and trench capacitors. Virtually ... Related Searches: 488 nm | 266nm cw laser | mopa | acousto-optic modulator

9.  Excimer Laser Marking of High Bandgap Wafer Materials ... Composite Fabric and Leather Glass Metal Paper Plastic Semiconductor Wood and Derivatives -- SELECT PROCESS -- Ablation-Material Removal Cladding Cutting and Scribing Drilling Heat Treating Marking and Engraving Sub-Surface Modification Surface Modification Welding and Soldering - The ExciStar S-Industrial ... Related Searches: excimer laser | sapphire scribing | 193 nm laser

10.    HighPeakPowerSolidStateLaserforMicromachiningofHardMaterialsRev2 Best match in this PDF  |  All matches in this PDF ... ;1.2, allowing excellent beam focusability. The Gator series of lasers have been specifically designed for micromachining of hard materials including cutting and drilling of both through, as well as, blind holes and slots. The distinguishing characteristic of the Gator is its high peak power, resulting ... Related Searches: trepanning head | yag laser | highlights | shutter

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