1 - 10 of 38 Search Results for wafer dicing
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1.
Silicon Wafer Dicing and Scribing
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Silicon Wafer Dicing and Scribing Superior Reliability & Performance Lasers and Laser-based Systems Laser Measurement and Control Precision Optics Related Accessories The AVIA 355-23-250 was specifically designed to address silicon wafer scribing and dicing applications, but also appears to have ...
Related Searches: pico | avia 355-23-250 | pulseeq | wafer cutting
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2.
Low-k Dielectric Scribing with UV DPSS Lasers
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... integrated circuits. Unfortunately, low-k dielectrics are not as mechanically strong as conventional dielectrics and thus create problems during wafer singulation (dicing) using mechanical saws. Diode-pumped solid-state (DPSS) UV lasers can be used to scribe low-k dielectrics, either alone or as an ...
Related Searches: laser scribing | avia-x | scan head | 532nm
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3.
Coherent Press Release
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... qualification testing. Based upon the feedback, we expect Talisker to be the solution of choice for a variety of applications including wafer dicing and solar cell manufacturing," he concluded. At March 29, 2008, Coherent’s cash, cash equivalents and short term investments totaled $184 ...
Related Searches: auburn facility
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4.
60410-346e-ILS
(PAGE 2 OF 4)
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... . This is called direct writing (see Figure 2), and the pin-point nature of direct writing has its own specifi c range of applications, such as wafer scribing and dice singulation. However, direct-write micromachining has the disadvantage of not being able to remove larger areas with smooth depth control ...
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5.
[index.cfm?fuseaction=Forms.ShowApp1List.cfm&startrow=26]
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... integrated circuits. Unfortunately, low-k dielectrics are not as mechanically strong as conventional dielectrics and thus create problems during wafer singulation (dicing) using mechanical saws. Diode-pumped ... more <- Last 5 rows Next 5 rows -> Contact Information ...
Related Searches: singulation | pcb
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6.
AVIA Applications
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... enable new processes, including the latest techniques for electronic package singulation, via hole drilling, solar cell processing, and silicon wafer scribing and dicing. The matrix is organized by application, materials processed, and product model. Our Product Matrix organizes AVIA lasers by product ...
Related Searches: avia | 355 nm cw | thinfilm solar scribing | avia 355-23-250
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8.
Technical Seminars on UV Lasers
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... applications. These two-hour seminars will include both a presentation and a question-and-answer session on topics including silicon wafer dicing, silicon drilling, solar cell processing, memory card singulation, and key applications in FPDs. In addition, the seminars will showcase some new DPSS ...
Related Searches: uv
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9.
Talisker_brochure
(PAGE 2 OF 4)
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... range of applications: · Production of flexible circuits/displays · Manufacturing biomedical devices · Making flat panel displays · Micromilling · Wafer dicing · Silicon machining · Metal surface treatments · Solar cell manufacturing Processing with Greater Precision Most processing industries today ...
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Coherent Contact Information