1 - 10 of 54 Search Results for wafer dicing
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3.
Talisker_Sapphire_Scribing_Whitepaper_final.pdf
(PAGE 1 OF 3)
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…efficiency and to lower production costs.
One particular focus of these efforts is in the area of
singulation, that is, the process of dicing a wafer
containing many LEDs into individual devices.
Traditionally, this has been accomplished using either
mechanical means or laser ablation…
Related Searches: laser scribing
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4.
Coherent Inc. Si Wafer Scribing, Cutting and Dicing with Lasers
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…DPSS UV lasers like the AVIA can dice thin wafers with good throughput and edge quality. Similarly the very brittle low-k materials that are so important in today’s advanced chips are best scribed by a DPSS UV laser. Lasers enable narrower street widths on the wafer further increasing overall yield…
Related Searches: laser dicing | low-k
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5.
Coherent Feature.qxd
(PAGE 2 OF 3)
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…effective for the thinner wafers and could create a production bottleneck.
Laser dicing and scribing
Where thinner wafers pose challenges to mechanical saws, they provide opportunities for photonic cutting tools; the thinner the wafer, the
faster a laser can dice it. Research
has demonstrated…
Related Searches: sapphire scribing
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6.
Coherent Inc. MATRIX QS DPSS Lasers enable Materials Processing
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…Ceramic, FPD, Glass, Metal, Polymer, Sapphire, Solar Cell/Panel, Wafer ⢠MATRIX 355 ⢠MATRIX 532 ⢠MATRIX 1064 Dicing/Scribing Materials Processing, Microelectronics Ceramic, FPD, Glass, Sapphire, Solar Cell/Panel, Wafer ⢠MATRIX 1064 ⢠MATRIX 355 ⢠MATRIX 532 Drilling…
Related Searches: matrix | matrix 355-1-60 | matrix 1064-10-30 | 1064 laser diode
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8.
Excimer laser for advanced Wafer Marking2008.qxd
(PAGE 1 OF 2)
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…of chip and its lot number must be created directly on the semiconductor.
This is often referred to as backside wafer marking, because the wafers are marked before
dicing, and the mark must be applied to the back
to avoid damaging the front-side circuitry.
Laser marking is a well…
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9.
Excimer laser for advanced Wafer Marking2008.qxd
(PAGE 1 OF 2)
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…of chip and its lot number must be created directly on the semiconductor.
This is often referred to as backside wafer marking, because the wafers are marked before
dicing, and the mark must be applied to the back
to avoid damaging the front-side circuitry.
Laser marking is a well…
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|
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10.
Talisker_Sapphire_Scribing_Whitepaper_final.pdf
(PAGE 1 OF 3)
|
|
…efficiency and to lower production costs.
One particular focus of these efforts is in the area of
singulation, that is, the process of dicing a wafer
containing many LEDs into individual devices.
Traditionally, this has been accomplished using either
mechanical means or laser ablation…
Related Searches: laser scribing
|
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